Film forming method and film forming apparatus of metal plating film

Patent metadata

Field	Value
Publication number	US-2022119956-A1
Application number	US-202117495362-A
Country	US
Kind code	A1
Filing date	Oct 6, 2021
Priority date	Oct 16, 2020
Publication date	Apr 21, 2022
Grant date	—

Abstract

A film forming method and a film forming apparatus of a metal plating film allowing suppressing damage of a porous film. A metal plating film on a surface of a metal substrate by solid substitution-type electroless plating method. The film forming method includes preparing the film forming apparatus that includes at least a bottom wall and a sidewall surrounding the bottom wall and that is provided with a housing space, the metal substrate disposed on the bottom surface inside the housing, the porous film disposed on the surface of the metal substrate, and an electroless plating solution housed in the housing space; and using the film forming apparatus, reducing metal ions derived from the electroless plating solution contained in the porous film, and depositing the metal ions on the surface of the metal substrate to form the metal plating film on the surface of the metal substrate.

First claim

What is claimed is:

1 . A film forming method of a metal plating film for forming a metal plating film on a surface of a metal substrate by solid substitution-type electroless plating method, the film forming method comprising:
preparing a film forming apparatus that includes a housing that includes at least a bottom wall and a sidewall surrounding the bottom wall and that is internally provided with a housing space, a metal substrate disposed on the bottom surface inside the housing, a porous film disposed on the surface of the metal substrate, and an electroless plating solution housed in the housing space; and using the film forming apparatus, reducing metal ions derived from the electroless plating solution contained in the porous film, and depositing the metal ions on the surface of the metal substrate to form the metal plating film on the surface of the metal substrate.

2 . The film forming method of the metal plating film according to claim 1 ,
wherein the film forming apparatus further includes a float member disposed on a surface of the porous film, wherein the float member has a density of 1.09 times or more and 1.65 times or less of a density of the electroless plating solution, and wherein the float member has a weight larger than a weight of the porous film.

3 . The film forming method of the metal plating film according to claim 1 ,
wherein the housing is made of a metal serving as a sacrificial anode.

4 . The film forming method of the metal plating film according to claim 3 ,
wherein the film forming apparatus further includes a lid that covers an opening of the housing, and wherein the lid is made of the same material as the material of the housing.

5 . A film forming apparatus for forming a metal plating film on a surface of a metal substrate by solid substitution-type electroless plating method, the film forming apparatus comprising:
a housing that includes at least a bottom wall and a sidewall surrounding the bottom wall and that is internally provided with a housing space; a metal substrate disposed on the bottom surface inside the housing; a porous film disposed on the surface of the metal substrate; and an electroless plating solution housed in the housing space.

6 . The film forming apparatus according to claim 5 , further comprising
a float member disposed on a surface of the porous film, wherein the float member has a density of 1.09 times or more and 1.65 times or less of a density of the electroless plating solution, and wherein the float member has a weight larger than a weight of the porous film.

7 . The film forming apparatus according to claim 5 ,
wherein the housing is made of a metal serving as a sacrificial anode.

8 . The film forming apparatus according to claim 7 , further comprising
a lid that covers an opening of the housing, wherein the lid is made of the same material as the material of the housing.

Assignees

• Toyota Motor Co Ltd

Inventors

• Iisaka Hirofumi

Classifications

• C23C18/54 Primary

  Contact plating, i.e. electroless electrochemical plating · CPC title

• C23C18/1637

  metallic substrate · CPC title

• C23C18/1632

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

• C23C18/1628

  Specific elements or parts of the apparatus · CPC title

• C23C18/1619 Primary

  Apparatus for electroless plating · CPC title