A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
metallic substrate
metallic substrate · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/1637 |
| Official title | {metallic substrate} |
| Display label | metallic substrate |
| Total patents | 251 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 20 |
| 2016 | 18 |
| 2017 | 38 |
| 2018 | 27 |
| 2019 | 22 |
| 2020 | 22 |
| 2021 | 31 |
| 2022 | 24 |
| 2023 | 13 |
| 2024 | 19 |
| 2025 | 13 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing a metal component, metal component, and turbocharger
US-2017370003-A1 · Dec 28, 2017 · US
Method for producing metal-plated stainless material
US-2017327953-A1 · Nov 16, 2017 · US
Nanocomposite magnetic materials for magnetic devices and systems
US-2017330657-A1 · Nov 16, 2017 · US
Nanocomposite magnetic materials for magnetic devices and systems
US-9818514-B2 · Nov 14, 2017 · US
Plated material and terminal using this plated material
US-2017314135-A1 · Nov 2, 2017 · US
Electrolessly formed high resistivity magnetic materials
US-2017314136-A1 · Nov 2, 2017 · US
Method of producing core-shell catalyst
US-9799889-B2 · Oct 24, 2017 · US
Method for regenerating plating liquid, plating method, and plating apparatus
US-2017283953-A1 · Oct 5, 2017 · US
Solder-coated ball and method for manufacturing same
US-2017274478-A1 · Sep 28, 2017 · US
Plating bath composition and method for electroless plating of palladium
US-9758874-B2 · Sep 12, 2017 · US
Manufacturing a package using plateable encapsulant
US-2017256472-A1 · Sep 7, 2017 · US
Horizontal method of electroless metal plating of substrates with ionic catalysts
US-2017251557-A1 · Aug 31, 2017 · US
Method for regenerating plating liquid, plating method, and plating apparatus
US-9702044-B2 · Jul 11, 2017 · US
Coating and electronic component
US-2017130337-A1 · May 11, 2017 · US
Surface improvement of additively manufactured articles produced with aluminum alloys
US-2017129060-A1 · May 11, 2017 · US
Plating bath composition and method for electroless plating of palladium
US-2017121823-A1 · May 4, 2017 · US
Methods of forming interconnects and semiconductor structures
US-9640433-B2 · May 2, 2017 · US
Electroless plating solution with at least two borane containing reducing agents
US-2017092499-A1 · Mar 30, 2017 · US
Methods for synthesizing nanometer-sized manganese dioxides having ramsdellite-type crystal structures as well as methods for producing hydroxide ion-derived proton, electron and oxygen using manganese dioxides
US-9586836-B2 · Mar 7, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/1637?
- CPC C23C18/1637 is the Cooperative Patent Classification code for “metallic substrate.”
- How many patents are filed under CPC C23C18/1637 (metallic substrate)?
- Our database includes 251 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/1637 growing?
- Publication counts under this code: 19 in 2024 vs 13 in 2025 (latest complete years).