Electroless plating method and ceramic substrate

Patent metadata

Field	Value
Publication number	US-9949374-B2
Application number	US-201414760758-A
Country	US
Kind code	B2
Filing date	Feb 4, 2014
Priority date	Feb 8, 2013
Publication date	Apr 17, 2018
Grant date	Apr 17, 2018

Abstract

Provided is an electroless plating method for a low temperature co-fired glass ceramic substrate, the method including: a degreasing and activation treatment step of degreasing and activating a surface of a wiring pattern formed of a silver sintered body; a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body; and an electroless multi-layered coating plating treatment step. The electroless plating method further includes, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of precipitating silver on a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step, and the catalyzing step includes providing the catalyst also to the silver precipitated in the silver precipitation treatment step.

First claim

The invention claimed is:

1. An electroless plating method for a glass ceramic substrate comprising an insulating base material formed of glass ceramic, and a wiring pattern formed of a silver sintered body, the electroless plating method comprising:
a degreasing and activation treatment step of degreasing and activating a surface of the wiring pattern formed of a silver sintered body;
a catalyzing step of providing a catalyst onto the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step; and
an electroless multi-layered coating plating treatment step of forming a multi-layered electroless plating coating on the surface of the wiring pattern formed of a silver sintered body on which the catalyst is provided,
the electroless plating method further comprising, between the degreasing and activation treatment step and the catalyzing step, a silver precipitation treatment step of dissolving and ionizing silver included in a glass component present on the surface of the wiring pattern formed of a silver sintered body after the degreasing and activation treatment step with a silver precipitation treatment liquid, and selectively redepositing the silver on the glass component, by executing a dissolving process and redepositing process with the silver precipitation treatment liquid having a pH adjusted to from 4 to 6 and having an acidic property,
wherein the silver precipitation treatment liquid comprises a first reducing agent or a combination of the first reducing agent and a second reducing agent,
the first reducing agent comprises a phosphoric acid compound or an organic acid, and the second reducing agent comprises an inorganic compound,
the catalyzing step comprising providing the catalyst also to the silver precipitated in the silver precipitation treatment step.

2. An electroless plating method according to claim 1 , wherein the electroless multi-layered coating plating treatment step comprises:
an electroless nickel plating step of forming an electroless nickel plating coating on the surface of the wiring pattern formed of a silver sintered body on which the catalyst is provided;
an electroless palladium plating step of forming an electroless palladium plating coating on the electroless nickel plating coating; and
a substitution-type electroless gold plating step of forming a substitution-type electroless gold plating coating on the electroless palladium plating coating.

3. An electroless plating method according to claim 2 , further comprising, between the electroless nickel plating step and the electroless palladium plating step, a glass etching treatment step of dissolving fine particles formed on glass ceramic with a glass etching liquid to remove the fine particles.

4. An electroless plating method according to claim 1 , wherein the electroless multi-layered coating plating treatment step comprises:
an electroless nickel plating step of forming an electroless nickel plating coating on the surface of the wiring pattern formed of a silver sintered body on which the catalyst is provided;
a substitution-type electroless gold plating step of forming a substitution-type electroless gold plating coating on the electroless nickel plating coating; and
a reduction-type electroless gold plating step of forming a reduction-type electroless gold plating coating on the substitution-type electroless gold plating coating.

5. An electroless plating method according to claim 4 , further comprising, between the electroless nickel plating step and the substitution-type electroless gold plating step, a glass etching treatment step of dissolving fine particles formed on glass ceramic with a glass etching liquid to remove the fine particles.

6. An electroless plating method according to claim 1 , wherein the phosphoric acid compound comprises hypophosphorous acid, sodium hypophosphite, or potassium hypophosphite.

7. An electroless plating method according to claim 1 , wherein the organic acid comprises formic acid or citric acid.

8. An electroless plating method according to claim 1 , wherein the inorganic compound comprises iron(II) chloride, iron(II) sulfate, or sodium thiosulfate.

9. An electroless plating method according to claim 1 , wherein the silver precipitation treatment step comprises precipitation and scattering of silver particles on the glass component present on the surface of the wiring pattern formed of the silver sintered body.

Assignees

• Mitsubishi Electric Corp

Inventors

• Takemoto Yohei
• Sekino Shiro
• Kaihatsu Yuta
• Yamanaka Hiromi

Classifications

• C23C18/36

  using hypophosphites · CPC title

• H05K1/092

  Dispersed materials, e.g. conductive pastes or inks · CPC title

• Y10T428/24917

  including metal layer · CPC title

• C23C18/44

  using reducing agents · CPC title

• C23C18/1844 Primary

  with use of organic or inorganic compounds other than metals, first · CPC title