Nanocomposite magnetic materials for magnetic devices and systems

Patent metadata

Field	Value
Publication number	US-11062826-B2
Application number	US-201715664647-A
Country	US
Kind code	B2
Filing date	Jul 31, 2017
Priority date	Jul 26, 2013
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

Nanocomposite magnetic materials, methods of manufacturing nanocomposite magnetic materials, and magnetic devices and systems using these nanocomposite magnetic materials are described. A nanocomposite magnetic material can be formed using an electro-infiltration process where nanomaterials (synthesized with tailored size, shape, magnetic properties, and surface chemistries) are infiltrated by electroplated magnetic metals after consolidating the nanomaterials into porous microstructures on planar substrates. The nanomaterials may be considered the inclusion phase, and the magnetic metals may be considered the matrix phase of the multi-phase nanocomposite.

First claim

What is claimed is:

1. A method of forming a nanocomposite magnetic material, comprising:
prior to an electro-infiltration process, consolidating synthesized nanomaterials of at least one inclusion phase into a porous microstructure, wherein consolidating synthesized nanomaterials comprises using at least one magnet or at least one external magnetic field to direct particles of the synthesized nanomaterials on a substrate within a first liquid solution and evaporating the first liquid solution to leave the consolidated synthesized nanomaterial as the porous microstructure on the substrate; and
after forming the porous microstructure, performing the electro-infiltration process within a second liquid solution to fill voids of the porous microstructure with a magnetic metal matrix phase.

2. The method of claim 1 , wherein performing the electro-infiltration process comprises electroplating the magnetic metal matrix phase within the voids of the porous microstructure.

3. The method of claim 1 , further comprising:
selecting the synthesized nanomaterials according to at least one of size, shape, surface coating and magnetic properties;
forming a mold on a planar substrate, wherein the synthesized nanomaterials are consolidated in the mold, wherein the substrate comprises the planar substrate;
removing the mold after performing the electro-infiltration process leaving bound consolidated nanomaterials on the planar substrate; and
removing unbound consolidated nanomaterials from the planar substrate,
wherein the synthesized nanomaterials comprise at least one shape selected from a group consisting of spherical, nanoflake, nanodisc, nanorod, and nanowire.

4. The method of claim 1 , wherein performing the electro-infiltration process comprises electroplating the metal magnetic matrix phase within the voids of the porous microstructure from a bottom surface to a top surface of the porous microstructure.

5. The method of claim 1 , wherein performing the electro-infiltration process comprises electroless plating of the magnetic metal matrix phase within the voids of the porous microstructure.

6. A method comprising:
performing semiconductor processing to fabricate at least one semiconductor device on a semiconductor wafer;
prior to an electro-infiltration process, forming a structure comprising magnetic material on the semiconductor wafer using a nanocomposite magnetic material, the nanocomposite magnetic material formed by consolidating synthesized nanomaterials of at least one inclusion phase into a porous microstructure on the semiconductor wafer within a first liquid solution and evaporating the first liquid solution to leave the consolidated synthesized nanomaterial as the porous microstructure on the semiconductor wafer; and
after forming the porous microstructure, performing the electro-infiltration process within a second liquid solution to fill voids of the porous microstructure with a magnetic metal matrix phase,
wherein the nanocomposite magnetic material comprises a plurality of bound consolidated nanomaterials of the at least one inclusion phase and the magnetic metal matrix phase.

7. The method of claim 6 , wherein performing the electro-infiltration process comprises electroplating the magnetic metal matrix phase within the voids of the porous microstructure.

8. The method of claim 6 , wherein performing the electro-infiltration process comprises electroplating the metal magnetic matrix phase within the voids of the porous microstructure from a bottom surface to a top surface of the porous microstructure.

9. The method of claim 6 , wherein performing the electro-infiltration process comprises electroless plating of the magnetic metal matrix phase within the voids of the porous microstructure.

10. The method of claim 6 , wherein the plurality of bound consolidated nanomaterials are a heterogeneous mixture of different sizes, different shapes, or both.

11. The method of claim 6 , wherein the plurality of bound consolidated nanomaterials have a same size and/or shape.

12. The method of claim 6 , wherein the plurality of bound consolidated nanomaterials comprises:
a first plurality of bound consolidated nanomaterials of a first inclusion phase and a first magnetic metal matrix phase; and
a second plurality of bound consolidated nanomaterials of a second inclusion phase and a second magnetic metal matrix phase,
wherein at least one of the first inclusion phase and the first magnetic metal matrix phase of the first plurality of bound consolidated nanomaterials is different than the second inclusion phase and the second magnetic matrix metal phase of the second plurality of bound consolidated nanomaterials.

13. The method of claim 1 , wherein the at least one inclusion phase comprises nanomaterials of a metal alloy with a dielectric shell.

14. The method of claim 13 , wherein the dielectric shell comprises an Al 2 O 3 coating, a ZrO 2 coating, a SiO 2 coating, or a polymer coating.

15. The method of claim 6 , wherein the at least one inclusion phase comprises nanomaterials of a metal alloy with a dielectric shell.

16. The method of claim 15 , wherein the dielectric shell comprises an Al 2 O 3 coating, a ZrO 2 coating, a SiO 2 coating, or a polymer coating.

17. The method of claim 6 , wherein consolidating synthesized nanomaterials comprises using at least one magnet or at least one external magnetic field to direct particles of the synthesized nanomaterials, wherein the consolidated synthesized nanomaterials is formed of a hard magnetic material and the magnetic metal matrix phase is formed of a soft magnetic material.

18. A method of forming a nanocomposite magnetic material, comprising:
prior to an electro-infiltration process, consolidating synthesized nanomaterials of at least one inclusion phase into a porous microstructure within a first liquid solution using an external magnetic field, wherein the first liquid solution is evaporated to leave the consolidated synthesized nanomaterial as the porous microstructure;
after forming the porous microstructure, performing the electro-infiltration process to fill voids of the porous microstructure with a magnetic metal matrix phase within a second liquid solution; and
applying an a magnetic back-electrode during the electro-infiltration process to ensure that the consolidated synthesized nanomaterials remain in place.

19. The method of claim 18 , wherein performing the electro-infiltration process comprises electroplating the magnetic metal matrix phase within the voids of the porous microstructure.

20. The method of claim 18 , wherein performing the electro-infiltration process comprises electroless plating of the magnetic metal matrix phase within the voids of the porous microstructure.

21. The method of claim 1 , wherein the external magnetic field is used to direct the particles of the synthesized nanomaterials prior to the electro-infiltration process, wherein the synthesized nanomaterials is formed of a hard magnetic material and the magnetic metal matrix phase is formed of a soft magnetic material.

Assignees

• Univ Florida

Inventors

• Arnold David P
• Andrew Jennifer S

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10D1/20

  Inductors · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• H01F1/0576 Primary

  pressed, e.g. hot working · CPC title

• C25D5/619 Primary

  Amorphous layers · CPC title