Method for forming electroless plating film and film formation device

Patent metadata

Field	Value
Publication number	US-2020407853-A1
Application number	US-202016907468-A
Country	US
Kind code	A1
Filing date	Jun 22, 2020
Priority date	Jun 28, 2019
Publication date	Dec 31, 2020
Grant date	—

Abstract

This disclosure provides a method for forming a plating film capable of suppressing deterioration of a plating solution, and a film formation device. The embodiment is a method for forming a metal plating film on a metal substrate by a substitution-type electroless plating method. The method includes bringing a porous film containing an electroless plating solution into contact with a surface of the metal substrate, and the porous film has an anionic group.

First claim

What is claimed is:

1 . A method for forming a metal plating film on a metal substrate by a substitution-type electroless plating method, the method comprising
bringing a porous film into contact with a surface of the metal substrate, the porous film having an anionic group and containing an electroless plating solution.

2 . The method according to claim 1 ,
wherein the bringing includes reducing metal ions derived from the electroless plating solution contained in the porous film to deposit the metal plating film on the surface of the metal substrate.

3 . The method according to claim 1 ,
wherein the anionic group comprises at least one kind selected from the group consisting of sulfonate group, thiosulfonate group, carboxy group, phosphate group, phosphonate group, hydroxy group, cyano group, or thiocyano group.

4 . The method according to claim 1 ,
wherein the porous film is a solid electrolyte membrane having an ionic conductivity.

5 . The method according to claim 4 ,
wherein the solid electrolyte membrane comprises a fluorine-based resin having sulfonate group.

6 . The method according to claim 5 ,
wherein the solid electrolyte membrane has an equivalent weight (EW) of 850 to 950 g/mol.

7 . The method according to claim 1 ,
wherein the electroless plating solution comprises an electroless gold plating solution.

8 . The method according to claim 7 ,
wherein the electroless gold plating solution comprises at least a gold compound and a complexing agent.

9 . The method according to claim 8 ,
wherein the gold compound comprises a non-cyanide gold salt, and the complexing agent comprises a non-cyanide complexing agent.

10 . The method according to claim 9 ,
wherein the non-cyanide gold salt comprises a gold sulfite salt.

11 . The method according to claim 9 ,
wherein the non-cyanide complexing agent comprises a sulfite salt.

12 . The method according to claim 10 ,
wherein the anionic group comprises sulfonate group.

13 . The method according to claim 9 ,
wherein the non-cyanide complexing agent comprises mercaptosuccinic acid.

14 . The method according to claim 13 ,
wherein the anionic group comprises carboxy group.

15 . The method according to claim 1 ,
wherein the metal substrate comprises nickel or a nickel alloy.

16 . The method according to claim 1 ,
wherein the electroless plating solution is supplied from a plating solution chamber that houses the electroless plating solution.

17 . The method according to claim 16 ,
wherein the plating solution chamber is disposed in contact with the porous film.

18 . A film formation device for forming a metal plating film on a metal substrate by a substitution-type electroless plating method, the film formation device comprising:
a porous film having an anionic group; a plating solution chamber disposed in contact with the porous film, the plating solution chamber housing an electroless plating solution; and a pressing unit that brings the porous film into contact with the metal substrate by relatively pressing the plating solution chamber and the metal substrate.

Assignees

• Toyota Motor Co Ltd

Inventors

• Iisaka Hirofumi

Classifications

• C23C18/42 Primary

  Coating with noble metals · CPC title

• C23C18/1641

  Organic substrates, e.g. resin, plastic · CPC title

• C23C18/1619

  Apparatus for electroless plating · CPC title

• C23C18/54 Primary

  Contact plating, i.e. electroless electrochemical plating · CPC title

• C23C18/1605

  by masking · CPC title