Fully automated wafer debonding system and method thereof

Patent metadata

Field	Value
Publication number	US-11670524-B2
Application number	US-202017110122-A
Country	US
Kind code	B2
Filing date	Dec 2, 2020
Priority date	Jan 31, 2020
Publication date	Jun 6, 2023
Grant date	Jun 6, 2023

Abstract

An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

First claim

What is claimed is:

1. A debonding system for debonding a pair of bonded wafers, comprising:
a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck;
a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers,
wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers; and
at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

2. The debonding system of claim 1 , wherein a cross section of a leading portion of each of the pair of circular plate separating blades has a shape selected from: a rounded wedge, a square wedge and a triangular wedge.

3. The debonding system of claim 1 , wherein each of the pair of circular plate separating blades have a Young's modulus in a range of from about 3 Gigapascal (GPa) to about 3.95 Gigapascal (GPa).

4. The debonding system of claim 1 , wherein the pair of circular plate separating blades are configured to rotate in an opposite direction of the rotating pair of bonded wafers.

5. The debonding system of claim 1 , wherein, during an insertion process, the pair of circular plate separating blades are controlled by an automatic optical inspection (AOI) system configured to control insertion depths of the pair of separating blades.

6. The debonding system of claim 5 , the AOI system is further configured to determine insertion points for inserting the pair of circular plate separating blades between the bonded wafers.

7. The debonding system of claim 5 , further comprising at least one pressure detector configured to monitor pressure applied to the first and second wafer during the insertion process of the pair of circular plate separating blades.

8. The debonding system of claim 1 , wherein the at least two pulling heads are configured to apply at least a first pull force and a second pull force, respectively.

9. The debonding system of claim 8 , wherein the first and second pull forces are set to be unequal.

10. The debonding system of claim 1 , further comprising:
monitoring, using pressure detectors, pressure in the pair of bonded wafers during the inserting step of the pair of circular plate separating blades.

11. A debonding system, comprising:
a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck;
a plurality of circular plate separating blades that are equally spaced from each other and arranged around the pair of bonded wafers and configured to rotate in an opposite direction of the rotating pair of bonded wafers,
wherein the plurality of circular plate separating blades are rotatably inserted between a first and a second wafers of the pair of bonded wafers;
a flex wafer assembly comprising of at least two pulling heads configured to pull the second wafer upwardly so as to debond the first wafer from the second wafer; and
an automatic optical inspection (AOI) system comprising of three-dimensional cameras configured to monitor a debonding process,
wherein the AOI system transmits feedback signals to actuators controlling the plurality of circular plate separating blades and the at least two pulling heads of the flex wafer assembly.

12. A debonding system of claim 11 , wherein the plurality of circular plate separating blades rotate at different speeds.

13. A debonding system of claim 11 , wherein the plurality of circular plate separating blades have a thickness in a range of from about 2 mm to about 6 mm.

14. A debonding system of claim 11 , wherein a first separating blade from the plurality of circular plate separating blades is inserted between the bonded wafers to a first distance, and a second separating blade from the plurality of circular plate separating blades is inserted between the bonded wafers to a second distance that is different from the first distance.

15. A debonding system of claim 11 , the AOI system is further configured to measure an inserting speed, depth, and slope of the plurality of circular plate separating blades and feedback the measured inserting speed, depth, and slope to a controller that is configured to control the rotating speed of the plurality of circular plate separating blades and the rotating speed of the bonded wafers.

16. A method for debonding a pair of bonded wafers, the method comprising:
attaching a pair of bonded wafers onto a wafer chuck using vacuum suction;
determining a bonding interface between the pair of bonded wafer using an automatic optical inspection (AOI) system;
determining a distance from a pair of circular plate blades to the pair of bonded wafers using the AOI system;
inserting the pair of circular plate blades into the bonding interface using a robotic arm;
rotating the pair of bonded wafers by rotating the wafer chuck attached to the bonded wafers; and
pulling up a top wafer of the pair of bonded wafers so as to debond the pair of bonded wafers, while simultaneously retracting the pair of circular plate blades from the bonded wafers.

17. The method of claim 16 , further comprising:
inspecting surface defects of the debonded wafers.

18. The method of claim 17 further comprising:
cleaning and re-polishing the debonded surfaces.

19. The method of claim 18 further comprising:
rotating the pair of bonded wafers four times, wherein each rotation is by 45 degrees.

20. The method of claim 16 , wherein the pair of circulate plate blades are rotated in an opposite direction to the rotating wafer chuck.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yu cheng-fei
• Tsao Chang-Chen
• Shiu Ting-Yau
• Hu Cheng-Kang
• Liu Hsu-Shui
• Pai Jiun-Rong

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10P90/16

  by reclaiming or re-processing · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title