Delamination method, delamination device, and delamination system

Patent metadata

Field	Value
Publication number	US-9724906-B2
Application number	US-201514633393-A
Country	US
Kind code	B2
Filing date	Feb 27, 2015
Priority date	Feb 27, 2014
Publication date	Aug 8, 2017
Grant date	Aug 8, 2017

Abstract

A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.

First claim

What is claimed is:

1. A delamination method for delaminating a laminated substrate which includes a first substrate and a second substrate bonded to each other, comprising:
adjusting, in a holding unit configured to hold the first substrate of the laminated substrate, a position of the laminated substrate held by the holding unit by a position adjusting unit by rotatably moving an arm portion of the position adjusting unit downward to make contact with a side surface of the laminated substrate and then disposing the holding unit at a predetermined height position;
disposing a sharp member of a delamination inducing unit at a predetermined height position, in the delamination inducing unit configured to form a delamination start part, in which the first substrate and the second substrate begin to be delaminated from each other, on the side surface of one end portion of the laminated substrate;
detecting a contact of the sharp member by bringing the sharp member into contact with the side surface of the one end portion of the laminated substrate;
inserting the sharp member into the side surface of the one end portion of the laminated substrate to form the delamination start part on the one end portion of the laminated substrate; and
delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate and moves the second substrate away from the first substrate, such that delamination proceeds from the one end portion of the laminated substrate toward the other end portion thereof using the delamination start part as a starting point.

2. The method of claim 1 , wherein the delamination inducing unit further includes a load cell configured to measure a force applied to the sharp member and a movement mechanism configured to move the sharp member, and
at the operation of detecting the contact of the sharp member, the contact of the sharp member is detected based on one or both of a change of the force measured by the load cell and a change of the torque of a motor of the movement mechanism.

3. The method of claim 1 , wherein the first substrate is a target substrate,
the second substrate is a support substrate which supports the target substrate, and
at the operation of detecting the contact of the sharp member, the sharp member is brought into contact with a side surface of the second substrate of the laminated substrate.

4. The method of claim 1 , wherein the laminated substrate is formed by bonding the first substrate and the second substrate through a bonding agent, and
at the operation of detecting the contact of the sharp member, the sharp member is brought into contact with a side surface of the bonding agent of the laminated substrate.

5. The method of claim 1 , wherein in the operation of inserting the sharp member into the side surface of the one end portion of the laminated substrate, the holding unit is rotated.

6. The method of claim 1 , wherein in the operation of delaminating the second substrate from the first substrate by the plurality of suction movement units, a first suction movement unit of the plurality of suction movement units, which sucks a peripheral edge portion of the second substrate at the one end portion, is moved in such a direction as to move the peripheral edge portion away from the first substrate while keeping a constant force applied to the first suction movement unit.

7. The method of claim 6 , wherein in the operation of delaminating the second substrate from the first substrate by the plurality of suction movement units, a second suction movement unit of the plurality of suction movement units, which sucks a region of the second substrate positioned closer to a central portion of the second substrate than the peripheral edge portion of the second substrate, is moved in such a direction as to move the region away from the first substrate while keeping a constant force applied to the second suction movement unit.

8. A delamination device for delaminating a laminated substrate which includes a first substrate and a second substrate bonded to each other, comprising:
a holding unit configured to hold the first substrate of the laminated substrate;
a plurality of suction movement units configured to suck the second substrate of the laminated substrate and to move the second substrate away from the first substrate;
a position adjusting unit configured to adjust a position of the laminated substrate at the holding unit;
a delamination inducing unit provided with a sharp member and configured to form a delamination start part, in which the first substrate and the second substrate begin to be delaminated from each other, on a side surface of one end portion of the laminated substrate, by bringing the sharp member into contact with the side surface of the one end portion of the laminated substrate held in the holding unit; and
a control device configured to control the holding unit, the plurality of suction movement units, the position adjusting unit and the delamination inducing unit so as to perform: adjusting a position of the laminated substrate held in the holding unit by the position adjusting unit by rotatably moving an arm portion of the position adjusting unit downward to make contact with the side surface of the laminated substrate and then disposing the holding unit at a predetermined height position; disposing the sharp member at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with the side surface of the one end portion of the laminated substrate; inserting the sharp member into the side surface of the laminated substrate to form the delamination start part on the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by the plurality of suction movement units such that delamination proceeds from the one end portion of the laminated substrate toward the other end portion thereof using the delamination start part as a starting point.

9. The device of claim 8 , wherein the delamination inducing unit further includes a load cell configured to measure a force applied to the sharp member and a movement mechanism configured to move the sharp member, and
the control device is configured to control the delamination inducing unit such that at the operation of detecting the contact of the sharp member, the contact of the sharp member is detected based on one or both of a change of the force measured by the load cell and a change of the torque of a motor of the movement mechanism.

10. The device of claim 8 , wherein the first substrate is a target substrate,
the second substrate is a support substrate which supports the target substrate, and
the delamination inducing unit is configured to bring the sharp member into contact with a side surface of the second substrate of the laminated substrate.

11. The device of claim 8 , wherein the laminated substrate is formed by bonding the first substrate and the second substrate through a bonding agent, and
the delamination inducing unit is configured to bring the sharp member into contact with a side surface of the bonding agent of the laminated substrate.

12. The device of claim 8 , further comprising:
a rotary mechanism configured to rotate the holding unit,
wherein the control device is configured to control the rotary mechanism so as to rotate the holding unit in the operation of inserting the sharp member into the side surface of the laminated substrate.

13. The device of claim 8 , wherein the plurality of suction movement units includes a fir

Assignees

• Tokyo Electron Ltd

Inventors

• Itou Masanori
• Sakamoto Ryoichi
• Sakaue Takashi

Classifications

• H10P72/7444

  using a peeling wedge, a knife or a bar · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• Y10T156/1184

  Piercing layer during delaminating [e.g., cutting, etc.] · CPC title

• Y10T156/1944

  Vacuum delaminating means [e.g., vacuum chamber, etc.] · CPC title