Wafer debonding system and method

Patent metadata

Field	Value
Publication number	US-10155369-B2
Application number	US-201715613963-A
Country	US
Kind code	B2
Filing date	Jun 5, 2017
Priority date	Nov 29, 2016
Publication date	Dec 18, 2018
Grant date	Dec 18, 2018

Abstract

The present disclosure relates to a method for debonding a pair of bonded substrates. In the method, a debonding apparatus is provided comprising a wafer chuck, a flex wafer assembly, and a set of separating blades. The pair of bonded substrates is placed upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface. The flex wafer assembly is placed above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair. A pair of separating blades having different thicknesses is inserted between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while the second substrate is concurrently pulled upward until the flex wafer assembly flexes the second substrate from the first substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

First claim

What is claimed is:

1. A method for debonding a pair of bonded substrates, comprising:
providing a debonding apparatus comprising a wafer chuck, a flex wafer assembly, and a set of separating blades;
placing the pair of bonded substrates upon the wafer chuck so that a first substrate of the bonded substrate pair is in contact with a chuck top surface;
placing the flex wafer assembly above the bonded substrate pair so that its first surface is in contact with an upper surface of a second substrate of the bonded substrate pair; and
inserting a pair of separating blades having different thicknesses between the first and second substrates from edges of the pair of bonded substrates diametrically opposite to each other while concurrently pulling the second substrate upward until the flex wafer assembly flexes the second substrate from the first substrate.

2. The method of claim 1 , further comprising pulling the second substrate by applying different pull forces to a first pulling head and a second pulling head of the flex wafer assembly, wherein the second pulling head is placed diametrically opposite to the first pulling head.

3. The method of claim 1 , further comprising monitoring the first substrate and the second substrate by a monitoring assembly to detect separate distance of the first substrate and the second substrate and to determine insert distances or pulling forces applied.

4. The method of claim 3 , wherein the monitoring assembly comprises a pair of three-dimensional cameras that are placed at opposite sides of the bonded substrates.

5. The method of claim 1 , wherein the pair of separating blades is inserted between the first substrate and second substrate to the same distance.

6. The method of claim 1 , wherein the debonding apparatus further comprises a programmable drive motor configured to move the second substrate perpendicular to a surface plane of the chuck top surface.

7. The method of claim 1 , wherein the wafer chuck and the flex wafer assembly respectively comprises vacuum pulling through the wafer chuck and the flex wafer assembly.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Tsao Chang-Chen
• Lu Kuo Liang
• Lee Ru-Liang
• Chuang Sheng-Hsiang
• Cheng Yu-Hung
• Tu Yeur-Luen
• Hu Cheng-Kang

Classifications

• H10P56/00

  Debonding of wafers, substrates or parts of devices · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P72/53

  using optical controlling means · CPC title