Semiconductor die, semiconductor package and substrate dicing method
US-2024421000-A1 · Dec 19, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/071 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 4,091 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 185 |
| 2016 | 186 |
| 2017 | 223 |
| 2018 | 259 |
| 2019 | 321 |
| 2020 | 332 |
| 2021 | 324 |
| 2022 | 387 |
| 2023 | 510 |
| 2024 | 596 |
| 2025 | 626 |
| 2026 | 142 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Electronic device and method of manufacturing the same
US-2024404904-A1 · Dec 5, 2024 · US
Electronic device and manufacturing method thereof
US-2024404831-A1 · Dec 5, 2024 · US
Flip-chip mounting structure and flip-chip mounting method
US-2024387444-A1 · Nov 21, 2024 · US
Apparatus and method for making a secured substrate
US-2024355722-A1 · Oct 24, 2024 · US
Conductive barrier direct hybrid bonding
US-2024243085-A1 · Jul 18, 2024 · US
Semiconductor packages and methods for fabricating the same
US-2024203855-A1 · Jun 20, 2024 · US
Semiconductor device and mounting structure for semiconductor element
US-2024170353-A1 · May 23, 2024 · US
Energy augmentation structures, energy emitters or energy collectors containing the same, and their use in solar cells and other energy conversion devices
US-2024115878-A1 · Apr 11, 2024 · US
Substrate processing apparatus and holding method of substrate
US-2024105497-A1 · Mar 28, 2024 · US
Method for manufacturing substrate with chips, and substrate processing device
US-2024079403-A1 · Mar 7, 2024 · US
Method of manufacturing semiconductor device and semiconductor device
US-2024006275-A1 · Jan 4, 2024 · US
Thermal interface material on package
US-2015364342-A1 · Dec 17, 2015 · US
Thermal interface material on package
US-2015364343-A1 · Dec 17, 2015 · US
Integrated circuit packaging system with pattern-through-mold and method of manufacture thereof
US-9202742-B1 · Dec 1, 2015 · US
Polymer powder, curable resin composition and cured material thereof
US-9193812-B2 · Nov 24, 2015 · US
Power module
US-2015319876-A1 · Nov 5, 2015 · US
Packaged semiconductor device having multilevel leadframes configured as modules
US-9177945-B2 · Nov 3, 2015 · US
Semiconductor Package with Switch Node Integrated Heat Spreader
US-2015311145-A1 · Oct 29, 2015 · US
Integrated circuit packaging system with embedded component and method of manufacture thereof
US-9171795-B2 · Oct 27, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/071?
- CPC H10W72/071 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10W72/071 (Electricity)?
- Our database includes 4,091 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/071 growing?
- Publication counts under this code: 596 in 2024 vs 626 in 2025 (latest complete years).