Wafer debonding system and method

Patent metadata

Field	Value
Publication number	US-10569520-B2
Application number	US-201816220163-A
Country	US
Kind code	B2
Filing date	Dec 14, 2018
Priority date	Nov 29, 2016
Publication date	Feb 25, 2020
Grant date	Feb 25, 2020

Abstract

The present disclosure relates to a debonding apparatus. In some embodiments, the debonding apparatus comprises a wafer chuck configured to hold a pair of bonded substrates on a chuck top surface. The debonding apparatus further comprises a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other. The first separating blade has a first thickness that is smaller than a second thickness of the second separating blade. The debonding apparatus further comprises a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate. By providing unbalanced initial torques on opposite sides of the bonded substrate pair, edge defects and wafer breakage are reduced.

First claim

What is claimed is:

1. A debonding apparatus for debonding a pair of bonded substrates, comprising:
a wafer chuck configured to hold the pair of bonded substrates on a chuck top surface;
a pair of separating blades including a first separating blade and a second separating blade placed at edges of the pair of bonded substrates diametrically opposite to each other, wherein the first separating blade has a first thickness that is smaller than a second thickness of the second separating blade; and
a flex wafer assembly placed above the pair of bonded substrates and configured to pull the pair of bonded substrates upwardly to separate a second substrate from a first substrate of the pair of bonded substrate.

2. The debonding apparatus of claim 1 , wherein the pair of separating blades is configured to facilitate the separating of the pair of bonded substrates by having the first separating blade inserted between the first substrate and second substrate to a first distance and having the second separating blade inserted between the first substrate and second substrate to a second distance.

3. The debonding apparatus of claim 2 , wherein the second distance is equal to the first distance.

4. The debonding apparatus of claim 1 , wherein the flex wafer assembly comprises a first pulling head and a second pulling head diametrically opposite to the first pulling head.

5. The debonding apparatus of claim 4 , wherein the first pulling head is placed at a first side of the second substrate closer to the first separating blade and the second pulling head is placed at a second side of the second substrate closer to the second separating blade, wherein the first pulling head is configured to apply a first pull force and the second pulling head is configured to apply a second pull force greater than the first pull force.

6. The debonding apparatus of claim 4 , wherein pull forces of the first pulling head and the second pulling head are controlled by a first coil spring and a second coil spring respectively coupled to the first pulling head and the second pulling head, and wherein a second spring coefficient of the second coil spring associated with the second pulling head is at least 10 times greater than that of a first spring coefficient of the first coil spring associated with the first pulling head.

7. The debonding apparatus of claim 1 , wherein the first separating blade and the second separating blade respectively has a rounded front wedge.

8. The debonding apparatus of claim 1 , wherein the first separating blade and the second separating blade respectively has a circular segment wedge that lines a circumference of the bonded substrates.

9. The debonding apparatus of claim 1 , wherein the first separating blade and the second separating blade are made of polyetheretherketone material.

10. The debonding apparatus of claim 1 , wherein a diameter of the wafer chuck is in a range of from about 0.5 to about 0.9 times of a diameter of the pair of bonded substrates.

11. A debonding apparatus for debonding a pair of bonded substrates, comprising:
a wafer chuck configured to hold and suck a first substrate of the pair of bonded substrates in contact with a chuck top surface;
a pair of separating blades including a first separating blade and a second separating blade that are configured to be placed at edges of the pair of bonded substrates diametrically opposite to each other; and
a flex wafer assembly comprising a first pulling head and a second pulling head diametrically opposite to the first pulling head, wherein the first pulling head and the second pulling head are configured to be placed above the pair of bonded substrates and to hold and move a second substrate of the pair of bonded substrates separated from the first substrate.

12. The debonding apparatus of claim 11 , wherein the first separating blade has a first thickness that is smaller than a second thickness of the second separating blade.

13. The debonding apparatus of claim 11 , wherein the first separating blade is inserted between the first substrate and second substrate to a first distance, and the second separating blade is inserted between the first substrate and second substrate to a second distance that is equal to the first distance.

14. The debonding apparatus of claim 11 , wherein the first pulling head is placed at a first side of the second substrate closer to the first separating blade and the second pulling head is placed at a second side of the second substrate closer to the second separating blade, wherein the first pulling head is configured to apply a first pull force and the second pulling head is configured to apply a second pull force greater than the first pull force.

15. The debonding apparatus of claim 11 , wherein the first separating blade has a pointed end with a first flare angle smaller than a second flare angle of the second separating blade.

16. A debonding apparatus for debonding a pair of bonded substrates, comprising:
a wafer chuck configured to hold and suck a first substrate of the pair of bonded substrates in contact with a chuck top surface;
a pair of separating blades including a first separating blade and a second separating blade having different thicknesses and configured to be inserted between the first substrate and a second substrate of the pair of bonded substrate from edges of the pair of bonded substrates diametrically opposite to each other; and
a flex wafer assembly comprising a first pulling head and a second pulling head diametrically opposite to the first pulling head, wherein the first pulling head and the second pulling head are configured to be placed above the pair of bonded substrates and to hold and pull the second substrate upward until the flex wafer assembly flexes the second substrate from the first substrate.

17. The debonding apparatus of claim 16 , wherein the first separating blade is inserted between the first substrate and second substrate to a first distance, and the second separating blade is inserted between the first substrate and second substrate to a second distance that is equal to the first distance.

18. The debonding apparatus of claim 16 , wherein the first pulling head is placed at a first side of the second substrate closer to the first separating blade and the second pulling head is placed at a second side of the second substrate closer to the second separating blade, wherein the first pulling head is configured to apply a first pull force and the second pulling head is configured to apply a second pull force greater than the first pull force.

19. The debonding apparatus of claim 16 , wherein the flex wafer assembly has additional pulling heads placed on top surfaces of the second substrate for pulling up the second substrate.

20. The debonding apparatus of claim 19 ,
wherein the pulling heads are distributed in a linear line that passes through a central axis of the second substrate and/or evenly spaced one from another; and
wherein pulling forces provided by the pulling heads are linearly or parabolic increased one from another.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Tsao Chang-Chen
• Lu Kuo Liang
• Lee Ru-Liang
• Chuang Sheng-Hsiang
• Cheng Yu-Hung
• Tu Yeur-Luen
• Hu Cheng-Kang

Classifications

• H10P56/00

  Debonding of wafers, substrates or parts of devices · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P72/53

  using optical controlling means · CPC title