A process for electrochemical deposition of copper with different current densities
US-2024183052-A1 · Jun 6, 2024 · US
Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/022 |
| Official title | {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} |
| Display label | Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates |
| Total patents | 748 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 60 |
| 2016 | 50 |
| 2017 | 56 |
| 2018 | 58 |
| 2019 | 49 |
| 2020 | 78 |
| 2021 | 73 |
| 2022 | 86 |
| 2023 | 87 |
| 2024 | 71 |
| 2025 | 70 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board
US-2015376444-A1 · Dec 31, 2015 · US
Conductive structure body precursor, conductive structure body and method for manufacturing the same
US-2015370359-A1 · Dec 24, 2015 · US
Multi-layer flexible metal-clad laminate and manufacturing method thereof
US-2015373843-A1 · Dec 24, 2015 · US
Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device
US-2015366069-A1 · Dec 17, 2015 · US
Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide
US-2015366056-A1 · Dec 17, 2015 · US
Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition
US-9215803-B2 · Dec 15, 2015 · US
Method for manufacturing metal foil-clad laminate
US-2015351236-A1 · Dec 3, 2015 · US
Polyimide metal clad laminate
US-2015336354-A1 · Nov 26, 2015 · US
Circuit board
US-2015342044-A1 · Nov 26, 2015 · US
Circuit board
US-2015342043-A1 · Nov 26, 2015 · US
Circuit board
US-2015342041-A1 · Nov 26, 2015 · US
Circuit board
US-2015342042-A1 · Nov 26, 2015 · US
Resin composition and its use
US-2015313012-A1 · Oct 29, 2015 · US
A halogen-free flame retardant resin composition and the use thereof
US-2015307703-A1 · Oct 29, 2015 · US
Multilayer film including first and second dielectric layers
US-2015302990-A1 · Oct 22, 2015 · US
Crosslinked fluoropolymer circuit materials, circuit laminates, and methods of manufacture thereof
US-2015296614-A1 · Oct 15, 2015 · US
Multilayer film including first and second dielectric layers
US-2015294793-A1 · Oct 15, 2015 · US
Metal/ceramic bonding substrate and method for producing same
US-2015284296-A1 · Oct 8, 2015 · US
Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device
US-9155203-B2 · Oct 6, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/022?
- CPC H05K3/022 is the Cooperative Patent Classification code for “Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates.”
- How many patents are filed under CPC H05K3/022 (Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates)?
- Our database includes 748 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/022 growing?
- Publication counts under this code: 71 in 2024 vs 70 in 2025 (latest complete years).