Control of current density in an electroplating apparatus

Patent metadata

Field	Value
Publication number	US-11225727-B2
Application number	US-202016878103-A
Country	US
Kind code	B2
Filing date	May 19, 2020
Priority date	Nov 7, 2008
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.

First claim

What is claimed is:

1. An apparatus comprising:
a reference electrode including an electrically conductive material, wherein the reference electrode is configured to be provided in an electroplating chamber having a substrate located therein, wherein the reference electrode is configured to provide a direct measure of a potential of an electrolyte at a location where the reference electrode resides, wherein the reference electrode includes a dynamically changeable shape and is configured to change from a first shape to a second shape during immersion of the substrate in the electrolyte in an electroplating process.

2. The apparatus of claim 1 , wherein the first shape and second shape are each arc shapes, and wherein the first shape and second shape extend to different angular extents.

3. The apparatus of claim 2 , wherein the first shape extends to a greater angular extent than the second shape.

4. The apparatus of claim 2 , wherein the first shape extends to a lower angular extent than the second shape.

5. The apparatus of claim 2 , wherein the first shape and second shape differ by an angular extent of at least about 10°.

6. The apparatus of claim 5 , wherein the first shape and second shape differ by an angular extent of at least about 30°.

7. The apparatus of claim 1 , wherein the reference electrode includes segments that slide over one another and/or telescope into one another.

8. The apparatus of claim 1 , wherein the reference electrode includes multiple segments that can be independently activated and deactivated.

Assignees

• Lam Res Corp

Inventors

• He Zhian
• Ramesh Ashwin
• Ghongadi Shantinath

Classifications

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• C25D17/00

  Constructional parts, or assemblies thereof, of cells for electrolytic coating · CPC title

• C25D17/12 Primary

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title