Control of current density in an electroplating apparatus

Patent metadata

Field	Value
Publication number	US-10011917-B2
Application number	US-201514664652-A
Country	US
Kind code	B2
Filing date	Mar 20, 2015
Priority date	Nov 7, 2008
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.

First claim

What is claimed is:

1. An apparatus for electroplating metal onto a substrate, the apparatus comprising:
a chamber for holding electrolyte;
a substrate holder for holding the substrate in the chamber;
a reference electrode comprising multiple segments that can be independently activated and de-activated; and
a controller configured to cause (i) activating multiple segments of the reference electrode before immersing the substrate in electrolyte, and (ii) independently de-activating one or more of the segments of the reference electrode as the substrate is immersed in electrolyte.

2. The apparatus of claim 1 , wherein the reference electrode is positioned radially outside of a periphery of the substrate at a location that is angularly offset from a substrate entry position, the angular offset being 60° or about 180°.

3. An apparatus for electroplating metal onto a substrate, the apparatus comprising:
a chamber for holding electrolyte;
a substrate holder for holding the substrate in the chamber; and
a reference electrode having a dynamically changeable shape.

4. The apparatus of claim 3 , wherein the reference electrode has at least a first shape and a second shape, the first and second shapes each being arc shapes, and the first and second shapes extending to different angular extents.

5. The apparatus of claim 4 , further comprising a controller having instructions to change the shape of the reference electrode from the first shape to the second shape as the substrate is immersed in electrolyte.

6. The apparatus of claim 5 , wherein the first shape extends to a greater angular extent than the second shape.

7. The apparatus of claim 5 , wherein the first shape extends to a lower angular extent than the second shape.

8. The apparatus of claim 5 , wherein the first shape and second shape differ by an angular extent of at least about 10°.

9. The apparatus of claim 8 , wherein the first shape and second shape differ by an angular extent of at least about 30°.

10. The apparatus of claim 3 , wherein the reference electrode comprises segments that slide over one another and/or telescope into one another.

11. The apparatus of claim 3 , wherein the reference electrode is positioned radially outside of a periphery of the substrate at a location that is angularly offset from a substrate entry position, the angular offset being between about 30-90°.

Assignees

• Lam Res Corp

Inventors

• He Zhian
• Ramesh Ashwin
• Ghongadi Shantinath

Classifications

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D17/12 Primary

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D5/18

  Electroplating using modulated, pulsed or reversing current · CPC title