Control of current density in an electroplating apparatus
US-11225727-B2 · Jan 18, 2022 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 79269543 |
| Family type | — |
| Earliest priority | Nov 7, 2008 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11225727B2 — Control of current density in an electroplating apparatus |
Best representative member for this family based on priority and filing country.
US11225727B2 — Control of current density in an electroplating apparatus (published Jan 18, 2022)
Related publications in this family.
US-11225727-B2 · Jan 18, 2022 · US
US-2020277708-A1 · Sep 3, 2020 · US