Electric field treatment method and electric field treatment device
US-2016326663-A1 · Nov 10, 2016 · US
Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
US9028666B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9028666-B2 |
| Application number | US-201213460423-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 30, 2012 |
| Priority date | May 17, 2011 |
| Publication date | May 12, 2015 |
| Grant date | May 12, 2015 |
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Abstract
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Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
First claim
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What is claimed is: 1. A method of immersing a wafer into an electrolyte of a plating bath, the method comprising: (a) positioning the wafer horizontally at a first height above the electrolyte, wherein a planar plating surface of the wafer is parallel to a plane defined by the surface of the electrolyte; (b) tilting the wafer at an angle such that the planar plating surface of the wafer is no longer parallel to the plane defined by the surface of the electrolyte; (c) moving t…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9028666B2 cover?
- Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
- Who is the assignee on this patent?
- Ranjan Manish, Ghongadi Shantinath, Wilmot Frederick Dean, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification C25D5/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue May 12 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).