Method and apparatus for forming backside die planar devices and saw filter
US-11037896-B2 · Jun 15, 2021 · US
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Zillmann Uwe patents
Zillmann Uwe is listed as an inventor on 21 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Zillmann Uwe |
| Total patents | 21 |
| First publication | Mar 15, 2016 |
| Latest publication | Jun 15, 2021 |
Notable patents
Publications ranked by popularity score, then publication date.
Voltage-to-current conversion
US-10554212-B2 · Feb 4, 2020 · US
Die with integrated microphone device using through-silicon vias (TSVs)
US-10455308-B2 · Oct 22, 2019 · US
Backside redistribution layer patch antenna
US-10403511-B2 · Sep 3, 2019 · US
Voltage-to-current conversion
US-2019229738-A1 · Jul 25, 2019 · US
Method and apparatus for forming backside die planar devices and saw filter
US-10290598-B2 · May 14, 2019 · US
Method and apparatus for forming backside die planar devices and saw filter
US-2019109107-A1 · Apr 11, 2019 · US
Integrated inductor for integrated circuit devices
US-10256286-B2 · Apr 9, 2019 · US
Power management in multi-die assemblies
US-10079489-B2 · Sep 18, 2018 · US
Integrated voltage regulators with magnetically enhanced inductors
US-9921640-B2 · Mar 20, 2018 · US
Recent patents
Latest publications not already listed above.
Through-body-via isolated coaxial capacitor and techniques for forming same
US-9911689-B2 · Mar 6, 2018 · US
Integrated inductor for integrated circuit devices
US-9881990-B2 · Jan 30, 2018 · US
Integrated inductor for integrated circuit devices
US-2017309700-A1 · Oct 26, 2017 · US
DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)
US-2017245035-A1 · Aug 24, 2017 · US
Integrated inductor for integrated circuit devices
US-9673268-B2 · Jun 6, 2017 · US
On-die inductor with improved q-factor
US-2017148750-A1 · May 25, 2017 · US
Through-body-via isolated coaxial capacitor and techniques for forming same
US-2017040255-A1 · Feb 9, 2017 · US
Power management in multi-die assemblies
US-2017011779-A1 · Jan 12, 2017 · US
Integrated inductor for integrated circuit devices
US-2016276424-A1 · Sep 22, 2016 · US
Power management in multi-die assemblies
US-9391453-B2 · Jul 12, 2016 · US
Resonant clocking for three-dimensional stacked devices
US-9287196-B2 · Mar 15, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 19 |
| Socionext Inc | 2 |
| Zillmann Uwe | 2 |
| Schaefer Andre | 1 |
| Saraswat Ruchir | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/20 | 16 |
| H01L23/481 | 13 |
| H10W20/497 | 12 |
| H10W20/023 | 10 |
| H01L23/5227 | 9 |