Microelectronic assemblies having an integrated capacitor
US-2024405006-A1 · Dec 5, 2024 · US
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Zhao Junnan patents
Zhao Junnan is listed as an inventor on 76 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Zhao Junnan |
| Total patents | 76 |
| First publication | Jul 4, 2019 |
| Latest publication | Dec 5, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Methods to selectively embed magnetic materials in substrate and corresponding structures
US-12154715-B2 · Nov 26, 2024 · US
Microelectronic assemblies having an integrated capacitor
US-12087746-B2 · Sep 10, 2024 · US
Substrate assembly with encapsulated magnetic feature
US-11901115-B2 · Feb 13, 2024 · US
Vented lids for integrated circuit packages
US-11894282-B2 · Feb 6, 2024 · US
Magnetic structures in integrated circuit package supports
US-11830809-B2 · Nov 28, 2023 · US
Electronic device including a lateral trace
US-2023352385-A1 · Nov 2, 2023 · US
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
US-11735537-B2 · Aug 22, 2023 · US
Microelectronic assemblies having an integrated capacitor
US-11721677-B2 · Aug 8, 2023 · US
Microelectronic assemblies having an integrated capacitor
US-2023238368-A1 · Jul 27, 2023 · US
Recent patents
Latest publications not already listed above.
Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate
US-11696407-B2 · Jul 4, 2023 · US
Substrate package with glass dielectric
US-2023187205-A1 · Jun 15, 2023 · US
Magnetic core inductors
US-11651885-B2 · May 16, 2023 · US
Electronic device including a lateral trace
US-11646254-B2 · May 9, 2023 · US
Cavity structures in integrated circuit package supports
US-11557489-B2 · Jan 17, 2023 · US
Microelectronic assemblies having an integrated capacitor
US-11557579-B2 · Jan 17, 2023 · US
Microelectronic assemblies having a cooling channel
US-11521914-B2 · Dec 6, 2022 · US
Methods to selectively embed magnetic materials in substrate and corresponding structures
US-2022367104-A1 · Nov 17, 2022 · US
Effective heat conduction from hotspot to heat spreader through package substrate
US-11502017-B2 · Nov 15, 2022 · US
Substrate assembly with encapsulated magnetic feature
US-2022359115-A1 · Nov 10, 2022 · US
Magnetic bilayer structure for a cored or coreless semiconductor package
US-11495555-B2 · Nov 8, 2022 · US
Thermal management solutions for integrated circuit packages
US-11482471-B2 · Oct 25, 2022 · US
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
US-2022328431-A1 · Oct 13, 2022 · US
Methods to selectively embed magnetic materials in substrate and corresponding structures
US-11450471-B2 · Sep 20, 2022 · US
Substrate assembly with encapsulated magnetic feature
US-11443892-B2 · Sep 13, 2022 · US
Thin film barrier seed metallization in magnetic-plugged through hole inductor
US-11443885-B2 · Sep 13, 2022 · US
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures
US-11417614-B2 · Aug 16, 2022 · US
Techniques for an inductor at a first level interface
US-2022230800-A1 · Jul 21, 2022 · US
Magnetic inductor structures for package devices
US-2022230951-A1 · Jul 21, 2022 · US
Phase change material in substrate cavity
US-11387224-B2 · Jul 12, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 74 |
| Tahoe Res Ltd | 2 |
| Intel Corpoation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 64 |
| H10W70/685 | 52 |
| H10W70/65 | 40 |
| H10W72/252 | 37 |
| H10W90/00 | 30 |