Thermal management solutions for integrated circuit packages

Patent metadata

Field	Value
Publication number	US-11482471-B2
Application number	US-201916287728-A
Country	US
Kind code	B2
Filing date	Feb 27, 2019
Priority date	Feb 27, 2019
Publication date	Oct 25, 2022
Grant date	Oct 25, 2022

Abstract

An integrated circuit package may be formed having a heat transfer fluid chamber, wherein the heat transfer fluid chamber may be positioned to allow a heat transfer fluid to directly contact an integrated circuit device within the integrated circuit package. In one embodiment, a first surface of the integrated circuit device may be electrically attached to a first substrate. The first substrate may then may be electrically attached to a second substrate, such that the integrated circuit device is between the first substrate and the second substrate. The second substrate may include a cavity, wherein the heat transfer fluid chamber may be formed between a second surface of the integrated circuit device and the cavity of the second substrate. Thus, at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid which flows into the heat transfer fluid chamber.

First claim

What is claimed is:

1. An integrated circuit assembly, comprising:
a first substrate;
an integrated circuit device having a first surface electrically attached to a first surface of the first substrate, wherein the integrated circuit device comprises a radio frequency device;
an additional integrated circuit device electrically attached to a second surface of the first substrate, wherein the additional integrated circuit device is electrically attached to the integrated circuit device through the first substrate, and wherein the additional integrated circuit device comprises an antenna;
a second substrate, wherein a first surface of the second substrate is electrically attached to the first surface of the first substrate and wherein the second substrate includes a cavity extending into the second substrate from the first surface thereof;
a heat transfer fluid chamber between a second surface of the integrated circuit device and the cavity of the second substrate, wherein at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid chamber;
at least one inlet port extending through the second substrate, wherein the at least one inlet port extends from the second surface of the second substrate to the heat transfer fluid chamber; and
at least one outlet port extending through the second substrate, wherein the at least one outlet port extends from the heat transfer fluid chamber to the second surface of the second substrate.

2. The integrated circuit assembly of claim 1 , further comprising an underfill material disposed between the first surface of the first substrate and the first surface of the second substrate.

3. The integrated circuit assembly of claim 2 , wherein the underfill material is further between the first surface of the first substrate and the first surface of the integrated circuit device.

4. The integrated circuit assembly of claim 1 , further comprising a sealant material between the first surface of the second substrate and a second surface of the integrated circuit device.

5. An electronic system, comprising:
a housing;
a board within the housing, wherein the board includes a cavity extending into the board from a first surface thereof;
an integrated circuit package electrically attached to the board, wherein the integrated circuit package comprises an integrated circuit device having a first surface electrically attached to a first surface of an interposer and an additional integrated circuit device electrically attached to a second surface of the interposer, wherein the additional integrated circuit device is electrically attached to the integrated circuit device through the interposer, wherein the integrated circuit device comprises a radio frequency device, wherein the additional integrated circuit device comprises an antenna, and wherein the first surface of the interposer is electrically attached to the first surface of the board;
a heat transfer fluid chamber between a second surface of the integrated circuit device and the cavity of the board, wherein at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid chamber;
at least one inlet port extending through the board, wherein the at least one inlet port extends from the second surface of the board to the heat transfer fluid chamber; and
at least one outlet port extending through the board, wherein the at least one outlet port extends from the heat transfer fluid chamber to the second surface of the board.

6. The electronic system of claim 5 , further comprising an underfill material disposed between the first surface of the interposer and the first surface of the board.

7. The electronic system of claim 6 , wherein the underfill material is further between the first surface of the interposer and the first surface of the integrated circuit device.

8. The electronic system of claim 5 , further comprising a sealant material between the first surface of the board and a second surface of the integrated circuit device.

9. A method of fabrication of an integrated circuit assembly, comprising:
forming a first substrate;
forming an integrated circuit device, wherein the integrated circuit device comprises a radio frequency device;
electrically attaching a first surface of the integrated circuit device to a first surface of the first substrate;
forming an additional integrated circuit device, wherein the additional integrated circuit device comprises an antenna;
electrically attaching an additional integrated circuit device to a second surface of the first substrate, wherein the additional integrated circuit device is electrically connected to the integrated circuit device through the first substrate;
forming a second substrate;
forming a cavity extending into the second substrate from the first surface thereof;
forming at least one inlet port and at least one outlet port, each extending through the second substrate from the cavity;
electrically attaching a first surface of the second substrate to the first surface of the first substrate; and
forming a heat transfer fluid chamber between a second surface of the integrated circuit device and the cavity of the second substrate, wherein at least a portion of the second surface of the integrated circuit device is exposed to the heat transfer fluid chamber.

10. The method of claim 9 , further comprising disposing an underfill material between the first surface of the first substrate and the first surface of the second substrate.

11. The method of claim 10 , further comprising disposing the underfill material between the first surface of the first substrate and the first surface of the integrated circuit device.

12. The method of claim 9 , further comprising forming a sealant material between the first surface of the second substrate and a second surface of the integrated circuit device.

13. An electronic system, comprising:
a housing;
a board within the housing, wherein the board includes a cavity extending into the board from a first surface thereof;
an integrated circuit package electrically attached to the board, wherein the integrated circuit package comprises an integrated circuit device having a first surface electrically attached to a first surface of an interposer and wherein the first surface of the interposer is electrically attached to the first surface of the board;
a sealant material between the first surface of the board and a second surface of the integrated circuit device;
a heat transfer fluid chamber between a second surface of the integrated circuit device and the cavity of the board, wherein at least a portion of a second surface of the integrated circuit device is exposed to the heat transfer fluid chamber;
at least one inlet port extending through the board, wherein the at least one inlet port extends from the second surface of the board to the heat transfer fluid chamber; and
at least one outlet port extending through the board, wherein the at least one outlet port extends from the heat transfer fluid chamber to the second surface of the board.

14. The electronic system of claim 13 , further comprising an underfill material disposed between the first surface of the interposer and the first surface of the board.

15. The electronic system of claim 14 , wherein the underfill material is further between the first surface of the interposer and the first surface of the integrated circuit device.

16. A method of fabrication of an integrated circuit assembly, comprising:
forming a first substrate;
forming an integrated circuit device;
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Assignees

• Intel Corp

Inventors

• Xu Cheng
• Zhao Junnan
• Wan Zhimin
• Wang Ying
• Deng Yikang
• Zhang Chong
• Sun Jiwei
• Jiang Zhenguo
• Lee Kyu-Oh

Classifications

• H10W44/248

  for antennas · CPC title

• H10W74/131

  the semiconductor body being only partially enclosed · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title