Methods for forming contact structures and semiconductor devices thereof
US-2026090351-A1 · Mar 26, 2026 · US
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Zhang Zhong patents
Zhang Zhong is listed as an inventor on 182 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Zhang Zhong |
| Total patents | 182 |
| First publication | Apr 30, 2015 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Three-dimensional memory devices and fabricating methods thereof
US-2026082565-A1 · Mar 19, 2026 · US
Vertical memory devices
US-12550329-B2 · Feb 10, 2026 · US
Memory device with word lines and contact landing
US-12543316-B2 · Feb 3, 2026 · US
Semiconductor devices with stacked structures
US-2026024557-A1 · Jan 22, 2026 · US
Three-dimensional memory device and fabrication method thereof
US-12526999-B2 · Jan 13, 2026 · US
Semiconductor device including a memory stack and a contact structure in a spacer structure
US-12519038-B2 · Jan 6, 2026 · US
Three-dimensional memory devices and methods for forming the same
US-2025385180-A1 · Dec 18, 2025 · US
Three-dimensional memory devices with stack structures, and fabricating methods thereof
US-12501614-B2 · Dec 16, 2025 · US
Managing connection structures in semiconductor devices
US-2025364413-A1 · Nov 27, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor package structure and manufacturing method thereof, and memory system
US-2025357271-A1 · Nov 20, 2025 · US
Contact structures in three-dimensional semiconductive devices
US-2025329644-A1 · Oct 23, 2025 · US
Managing contact structures in semiconductor devices
US-2025323151-A1 · Oct 16, 2025 · US
Three-dimensional memory devices and methods for forming the same
US-12432921-B2 · Sep 30, 2025 · US
Three-dimensional memory device having source-select-gate cut structures and methods for forming the same
US-2025280542-A1 · Sep 4, 2025 · US
Memory device and fabrication method thereof
US-2025266354-A1 · Aug 21, 2025 · US
Three-dimensional memory and manufacturing method thereof
US-2025248032-A1 · Jul 31, 2025 · US
Contact structures for three-dimensional memory devices and methods for forming the same
US-2025246552-A1 · Jul 31, 2025 · US
Three-dimensional memory device with backside interconnect structures
US-2025220908-A1 · Jul 3, 2025 · US
Three-dimensional memory devices with supporting structure for staircase region and spacer structure for contact structure and methods for forming the same
US-2025212407-A1 · Jun 26, 2025 · US
Three-dimensional memory device having source-select-gate cut structures and methods for forming the same
US-12336181-B2 · Jun 17, 2025 · US
Contact structures for three-dimensional memory
US-2025183177-A1 · Jun 5, 2025 · US
Memory device and fabrication method thereof
US-12315802-B2 · May 27, 2025 · US
Three-dimensional memory device with backside interconnect structures
US-12302573-B2 · May 13, 2025 · US
Three-dimensional memory and manufacturing method thereof
US-12302558-B2 · May 13, 2025 · US
Three-dimensional memory devices and fabricating methods thereof
US-2025142833-A1 · May 1, 2025 · US
Staircase structure in three-dimensional memory device and method for forming the same
US-2025133734-A1 · Apr 24, 2025 · US
Contact structures for three-dimensional memory devices and methods for forming the same
US-12283547-B2 · Apr 22, 2025 · US
Three-dimensional memory devices with supporting structure for staircase region and spacer structure for contact structure and methods for forming the same
US-12279429-B2 · Apr 15, 2025 · US
Three-dimensional nand memory device and method of forming the same
US-2025120086-A1 · Apr 10, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yangtze Memory Tech Co Ltd | 167 |
| Huawei Tech Co Ltd | 13 |
| Zhang Zhong | 2 |
| Zte Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.