Skew detection and compensation for high speed i/o links
US-2025341570-A1 · Nov 6, 2025 · US
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Ye Xiaoning patents
Ye Xiaoning is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ye Xiaoning |
| Total patents | 35 |
| First publication | Aug 18, 2015 |
| Latest publication | Nov 6, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of terminating unused ports during crosstalk measurement
US-2025251447-A1 · Aug 7, 2025 · US
High frequency terminations in electronic circuits
US-2025253513-A1 · Aug 7, 2025 · US
Skew detection and compensation for high speed I/O links
US-12372574-B2 · Jul 29, 2025 · US
Magnetically secured semiconductor chip package loading assembly
US-12309933-B2 · May 20, 2025 · US
Composite backplate architectures for backside power delivery and associated methods
US-2025089192-A1 · Mar 13, 2025 · US
Transverse magnetic mode split post dielectric resonator
US-2025070443-A1 · Feb 27, 2025 · US
Dual-stripline with crosstalk cancellation
US-12113265-B2 · Oct 8, 2024 · US
Dual in-line memory module (dimm) solution that includes flexible transmission lines
US-2024237193-A1 · Jul 11, 2024 · US
Printed circuit board pin field signal routing
US-2024176941-A1 · May 30, 2024 · US
Recent patents
Latest publications not already listed above.
Integrated circuit supports with microstrips
US-2024088069-A1 · Mar 14, 2024 · US
Integrated circuit supports with microstrips
US-2024063134-A1 · Feb 22, 2024 · US
Dual-stripline with crosstalk cancellation
US-2022311114-A1 · Sep 29, 2022 · US
Integrated circuit supports with microstrips
US-2022270989-A1 · Aug 25, 2022 · US
Magnetically secured semiconductor chip package loading assembly
US-2021378099-A1 · Dec 2, 2021 · US
Technologies for verifying a de-embedder for interconnect measurement
US-11169194-B2 · Nov 9, 2021 · US
Skew detection and compensation for high speed i/o links
US-2021311120-A1 · Oct 7, 2021 · US
Connector with active circuit
US-10965047-B2 · Mar 30, 2021 · US
Dielectric coating for crosstalk reduction
US-10925152-B2 · Feb 16, 2021 · US
Reduction of insertion loss in printed circuit board signal traces
US-10827627-B2 · Nov 3, 2020 · US
Technologies for verifying a de-embedder for interconnect measurement
US-2020292603-A1 · Sep 17, 2020 · US
Technologies for verifying a de-embedder for interconnect measurement
US-10571501-B2 · Feb 25, 2020 · US
Connector with active circuit
US-2019288421-A1 · Sep 19, 2019 · US
Reduction of insertion loss in printed circuit board signal traces
US-2019223299-A1 · Jul 18, 2019 · US
Dielectric coating for crosstalk reduction
US-2019045623-A1 · Feb 7, 2019 · US
Signal routing with reduced crosstalk
US-9893761-B2 · Feb 13, 2018 · US
Technologies for verifying a de-embedder for interconnect measurement
US-2017269136-A1 · Sep 21, 2017 · US
Absorbing termination in an interconnect
US-9750129-B2 · Aug 29, 2017 · US
Devices and methods to reduce differential signal pair crosstalk
US-9554454-B2 · Jan 24, 2017 · US
Absorbing termination in an interconnect
US-2017006698-A1 · Jan 5, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 31 |
| Univ Missouri | 3 |
| Sk Hynix Nand Product Solutions Corp Dba Solidigm | 1 |
| Ye Xiaoning | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0216 | 11 |
| H04L25/03006 | 7 |
| H10W44/216 | 7 |
| H10W70/65 | 7 |
| H05K1/0245 | 7 |