Dielectric coating for crosstalk reduction

Patent metadata

Field	Value
Publication number	US-10925152-B2
Application number	US-201816146168-A
Country	US
Kind code	B2
Filing date	Sep 28, 2018
Priority date	Sep 28, 2018
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

Apparatuses, systems and methods associated with dielectric coatings for printed circuit boards are disclosed herein. In embodiments, a printed circuit board (PCB) includes a substrate, microstrip conductors located on a surface of the substrate, a solder mask covering the surface of the substrate and the microstrip conductors, and a dielectric coating located on the solder mask, the dielectric coating on an opposite side of the solder mask from the microstrip conductors, wherein a thickness of the dielectric coating is selected to cause a ratio of capacitive coupling to self capacitance to be approximately equal to a ratio of inductive coupling to self inductance for each microstrip conductor of the microstrip conductors, where the thickness may be determined based on a specific methodology including simulations. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. A printed circuit board (PCB), comprising:
a substrate;
first and second microstrip conductors located on a surface of the substrate;
a solder mask covering the surface of the substrate and the first and second microstrip conductors; and
a dielectric coating disposed on the solder mask, on an opposite side of the solder mask from the first and second microstrip conductors, wherein a thickness of the dielectric coating is selected to provide a ratio of capacitive coupling to self capacitance for each of the first and second microstrip conductors to be approximately equal, within 25%, to a ratio of inductive coupling to self inductance for each of the first and second microstrip conductors.

2. The PCB of claim 1 , wherein the dielectric coating is approximately conformal with a surface of the solder mask, the surface of the solder mask being at an opposite side of the solder mask from the substrate.

3. The PCB of claim 2 , wherein the thickness of the dielectric coating is between 0.5 mils and 10 mils.

4. The PCB of claim 1 , wherein the thickness of the dielectric coating is a first thickness of the dielectric coating, wherein a first portion of the dielectric coating having the first thickness is located on a first portion of the solder mask that covers the microstrip conductors, and wherein a second portion of the dielectric coating that is located on a second portion of the solder mask that covers the substrate has a second thickness, the second thickness being thicker than the first thickness.

5. The PCB of claim 1 , wherein a thickness of the dielectric coating on a portion of the solder mask is approximately uniform, the portion of the solder mask located on the first and second microstrip conductors.

6. The PCB of claim 5 , wherein the thickness of the dielectric coating is between 0.5 mils and 10 mils.

7. The PCB of claim 1 , wherein the first and second microstrip conductors are a first pair of microstrip conductors, wherein the thickness of the dielectric coating is a first thickness of the dielectric coating, wherein the PCB further includes a second pair of microstrip conductors, wherein a first portion of the dielectric coating located on the first pair of microstrip conductors has the first thickness, and wherein a second portion of the dielectric coating located on the second pair of microstrip conductors has a second thickness, the second thickness different than the first thickness.

8. The PCB of claim 1 , wherein the thickness of dielectric coating is based on a thickness of the microstrip conductors, a distance between the microstrip conductors, a thickness of the substrate, a dielectric constant of the substrate, a thickness of the solder mask, a dielectric constant of the solder mask, and a dielectric constant of the dielectric coating.

9. The PCB of claim 1 , wherein the PCB is a motherboard of a server or a mobile device.

10. An electrical component, comprising:
a substrate;
a pair of dies mounted to the substrate;
a pair of microstrip conductors comprising first and second microstrip conductors, located on a surface of the substrate, wherein the pair of microstrip conductors couple the pair of dies; and
a dielectric coating disposed on a solder mask covering the surface of the substrate, wherein a thickness of the dielectric coating is selected to provide a ratio of capacitive coupling to self capacitance for each of the first and second microstrip conductors to be approximately equal, within 25%, to a ratio of inductive coupling to self inductance for each of the first and second microstrip conductors.

11. The electrical component of claim 10 , wherein the thickness of the dielectric coating is based on a thickness of the pair of microstrip conductors, a distance between the pair of microstrip conductors, a thickness of the substrate, a dielectric constant of the substrate, and a dielectric constant of the dielectric coating.

12. The electrical component of claim 10 , wherein the thickness of the dielectric coating is approximately uniform.

13. The electrical component of claim 10 , wherein the pair of dies is a first pair of dies, wherein the pair of microstrip conductors is a first pair of microstrip conductors, wherein the dielectric coating is a first dielectric coating, wherein the thickness is a first thickness, wherein the electrical component further comprises:
a second pair of dies mounted to the substrate;
a second pair of microstrip conductors located on a surface of the substrate, wherein the second pair of microstrip conductors couple the second pair of dies; and
a second dielectric coating having a second thickness, the second thickness being different from the first thickness.

14. The electrical component of claim 13 , wherein the first pair of dies are mounted to a first side of the substrate and the second pair of dies are mounted to a second side of the substrate, the second side opposite to the first side.

15. The electrical component of claim 10 , wherein the electrical component is a semiconductor package.

16. A method for producing a dielectric coating of a printed circuit board (PCB), comprising:
determining an inductive coupling of first and second microstrip conductors of a pair of microstrip conductors located on a surface of a substrate of the PCB;
determining a self inductance of the first and second microstrip conductor of the pair of microstrip conductors;
calculating a quantitative correlation between the inductive coupling to the self inductance;
determining a capacitive coupling of each of the first and second microstrip conductors of the pair of microstrip conductors;
determining a thickness of the dielectric coating based at least in part on a quantitative correlation of the capacitive coupling to a self capacitance of each of the first and second microstrip conductors and the quantitative correlation of the inductive coupling to the self inductance,
wherein the thickness is selected to provide a ratio of the capacitive coupling to self capacitance for each of the first and second microstrip conductors to be approximately equal, within 25%, to a ratio of inductive coupling to self inductance for each of the first and second microstrip conductors to form the dielectric coating on a surface of the PCB, the pair of microstrip conductors being located between the surface of the substrate and the surface of the PCB and the dielectric coating having the thickness.

17. The method of claim 16 , wherein the inductive coupling, the self inductance, and the capacitive coupling are determined based on a thickness of the first and second microstrip conductors, a width of the first and second microstrip conductors, and a distance between the first and second microstrip conductors.

18. The method of claim 16 , wherein determining the inductive coupling, the self inductance, and the capacitive coupling is performed by a simulator based on characteristics of the PCB provided to the simulator, and wherein determining the thickness of the dielectric coating includes:
arranging the simulator to increment through a plurality of thicknesses for the dielectric coating;
causing the simulator to determine an amount of far end crosstalk (FEXT) of the first and second microstrip conductors for each thickness within the plurality of thicknesses; and
determining the thickness of the dielectric coating to be one of the thicknesses from the plurality of thicknesses that produces a lowest amount of FEXT.

Assignees

• Intel Corp

Inventors

• Sutono Albert
• Ye Xiaoning
• Hsu Jimmy
• Hull Daniel

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W44/223

  Differential pair signal lines · CPC title

• H10W44/216

  Waveguides, e.g. strip lines · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title