Absorbing termination in an interconnect

Patent metadata

Field	Value
Publication number	US-9750129-B2
Application number	US-201615265704-A
Country	US
Kind code	B2
Filing date	Sep 14, 2016
Priority date	Aug 20, 2014
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An apparatus comprising:
a printed circuit board (PCB) comprising at least one transmission line to route an electrical signal within the PCB, wherein at least one end of the transmission line reaches a surface of the PCB, to couple with a connecting component that comprises a connector slot disposed on the surface of the PCB; and
a connecting element inserted in the connector slot, wherein at least a surface of the connecting element that faces the connector slot is covered with an absorbing material in direct contact with electrical contacts comprising at least a portion of the connector slot, to at least partially absorb a portion of the electrical signal.

2. The apparatus of claim 1 , wherein the connecting component is a first connecting component, wherein the connector slot is a first connector slot, wherein the connecting element is a first connecting element of a first computing component coupled with the apparatus.

3. The apparatus of claim 2 , further comprising a second connecting component coupled with the transmission line, wherein the second connecting component comprises a second connector slot to receive a corresponding second connecting element of a second computing component coupled with the apparatus.

4. The apparatus of claim 3 , wherein the second connecting component comprises a dual in-line memory module (DIMM) connector, wherein the second computing component comprises a memory module to receive and store data indicated by the electrical signal routed within the PCB, and wherein the portion of the electrical signal to be at least partially absorbed by the first connecting element comprises a reflected portion of the electrical signal.

5. The apparatus of claim 4 , wherein a dielectric loss tangent of the absorbing material is greater than one, for a frequency range of a resonant frequency of the reflected portion of the electrical signal.

6. The apparatus of claim 5 , wherein the dielectric loss tangent of the absorbing material is substantially constant for the resonant frequency range of the frequency of the reflected portion of the electrical signal.

7. The apparatus of claim 4 , wherein a relative dielectric constant of the absorbing material is inversely proportionate to a frequency of the reflected portion of the electrical signal.

8. The apparatus of claim 3 , wherein the first connecting component comprises a dual in-line memory module (DIMM) connector, and wherein the first computing component comprises a dummy module.

9. The apparatus of claim 1 , wherein the electrical signal comprises a transmission signal transmitted at a frequency between 5 and 7 GHz.

10. An apparatus, comprising:
a connecting element insertable in a connector slot disposed on a surface of a printed circuit board (PCB), wherein at least a surface of the connecting element that faces the connector slot is covered with an absorbing material in direct contact with electrical contacts comprising at least a portion of the connector slot, to at least partially absorb a portion of an electrical signal routed through a transmission line that is coupled with the connector slot, wherein the transmission line is disposed substantially inside the PCB and reaches a surface of the PCB to couple with the connector slot.

11. The apparatus of claim 10 , wherein a dielectric loss tangent of the absorbing material is greater than one, for a frequency range of a resonant frequency of a portion of the electrical signal reflected by the connector slot.

12. The apparatus of claim 11 , wherein the dielectric loss tangent of the absorbing material is substantially constant for the resonant frequency range of the frequency of the reflected portion of the electrical signal.

13. The apparatus of claim 10 , further comprising a dummy module, wherein the connecting element is coupled with the dummy module.

14. The apparatus of claim 10 , wherein the connector slot comprises a dual in-line memory module (DIMM) connector.

15. The apparatus of claim 10 , wherein the portion of the electrical signal to be at least partially absorbed by the connecting element comprises a reflected portion of the electrical signal, wherein a relative dielectric constant of the absorbing material is inversely proportionate to a frequency of the reflected portion of the electrical signal.

16. A method, comprising:
providing a connecting element insertable in a connector slot disposed on a surface of a printed circuit board (PCB); and
applying an absorbing material to at least a surface of the connecting element that faces the connector slot, to at least partially absorb a portion of an electrical signal routed through a transmission line that is disposed inside the PCB and reaches a surface of the PCB to couple with the connector slot, wherein applying an absorbing material includes directly covering the surface of the connecting element with the absorbing material, to provide direct contact with electrical contacts comprising at least a portion of the connector slot.

17. The method of claim 16 , wherein a dielectric loss tangent of the absorbing material is greater than one, for a frequency range of a resonant frequency of a portion of the electrical signal reflected by the connector slot.

18. The method of claim 17 , wherein the dielectric loss tangent of the absorbing material is substantially constant for the resonant frequency range of the frequency of the reflected portion of the electrical signal.

19. The method of claim 16 , wherein providing a connecting element includes providing a dummy module insertable in the connector slot, wherein the dummy module includes the connecting element.

20. The method of claim 16 , wherein the portion of the electrical signal to be at least partially absorbed by the connecting element comprises a reflected portion of the electrical signal, wherein a relative dielectric constant of the absorbing material is inversely proportionate to a frequency of the reflected portion of the electrical signal.

Assignees

• Intel Corp

Inventors

• Huang Shaowu
• Xiao Kai
• Lee Beom-Taek
• Wu Boping
• Ye Xiaoning

Classifications

• H05K2201/10159

  Memory · CPC title

• H04L25/03006

  Arrangements for removing intersymbol interference · CPC title

• H01P1/268 Primary

  Strip line terminations (H01P1/262 takes precedence) · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title