Resin composition, prepreg containing same, laminate, and printed circuit board
US-12104054-B2 · Oct 1, 2024 · US
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Yang Zhongqiang patents
Yang Zhongqiang is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yang Zhongqiang |
| Total patents | 24 |
| First publication | Jan 7, 2016 |
| Latest publication | Oct 1, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same
US-11744013-B2 · Aug 29, 2023 · US
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
US-11377551-B2 · Jul 5, 2022 · US
Resin composition, prepreg containing same, laminate, and printed circuit board
US-2022153989-A1 · May 19, 2022 · US
Resin composition, prepreg containing same, and laminate board and printed circuit board
US-2022135788-A1 · May 5, 2022 · US
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
US-11319397-B2 · May 3, 2022 · US
Circuit board and process for preparing the same
US-11191158-B2 · Nov 30, 2021 · US
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
US-2020224026-A1 · Jul 16, 2020 · US
Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit board
US-2020207899-A1 · Jul 2, 2020 · US
Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same
US-10494502-B2 · Dec 3, 2019 · US
Recent patents
Latest publications not already listed above.
Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof
US-10400058-B2 · Sep 3, 2019 · US
Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof
US-10400173-B2 · Sep 3, 2019 · US
Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same
US-2018263115-A1 · Sep 13, 2018 · US
Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit boards using the same
US-2018126701-A1 · May 10, 2018 · US
Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereof
US-2018112133-A1 · Apr 26, 2018 · US
Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same
US-2018086895-A1 · Mar 29, 2018 · US
Degradable Resin Composition, and Prepreg, Laminate and Copper Clad Laminate Using Same, and Degrading method thereof
US-2017321001-A1 · Nov 9, 2017 · US
Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same
US-9752028-B2 · Sep 5, 2017 · US
Circuit Board and Process for Preparing the Same
US-2017238417-A1 · Aug 17, 2017 · US
Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
US-9611377-B2 · Apr 4, 2017 · US
Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
US-2016185939-A1 · Jun 30, 2016 · US
Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same
US-2016185952-A1 · Jun 30, 2016 · US
Halogen-Free Thermosetting Resin Composition, Prepreg and Laminate for Printed Circuit Prepared From the Same
US-2016185953-A1 · Jun 30, 2016 · US
Circuit substrate and process for preparing the same
US-2016007452-A1 · Jan 7, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shengyi Technology Co Ltd | 24 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C08J5/24 | 19 |
| C08J5/249 | 16 |
| C08K3/36 | 16 |
| H05K1/0373 | 16 |
| H05K1/0366 | 15 |