Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof

Patent metadata

Field	Value
Publication number	US-10400058-B2
Application number	US-201515534557-A
Country	US
Kind code	B2
Filing date	May 27, 2015
Priority date	Dec 11, 2014
Publication date	Sep 3, 2019
Grant date	Sep 3, 2019

Abstract

Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.

First claim

The invention claimed is:

1. A degradable resin composition for copper clad laminates comprising an epoxy resin, a degradable amine curing agent, a degradable thiol curing agent and an inorganic filler,
wherein the resin composition does not comprise a curing accelerator,
wherein the degradable amine curing agent has the following structure:

and wherein the degradable thiol curing agent has the following structure:

wherein R 1 and R 2 are independently anyone selected from the group consisting of hydrogen atom, alkyl group, cycloalkyl group, heterocyclic group, heterocycloalkyl group, alkenyl group, cycloalkenyl group, aromatic group, heteroaromatic group, alkyl heteroalkyl group, alkynyl group, alkylene group, alkylene heteroalkylene, alkenylene group, alkylene heteroalkenylene, alkynylene group or alkylene heteroalkynylene,
wherein R 3 and R 4 are independently anyone selected from the group consisting of alkylene group, alkylene heteroalkylene, alkenylene group, alkenylene heteroalkenylene, alkylene heteroalkenylene, alkynylene group, cycloalkylene group, alkylene cycloalkylene, alkylene cycloalkylene alkylene, alkenylene cycloalkylene, alkenylene cycloalkylene alkenylene, alkylene cycloalkylene alkenylene, alkynylene cycloalkylene, alkynylene cycloalkylene alkynylene, heterocycloalkylene group, alkylene heterocycloalkylene, alkylene heterocycloalkyl alkylene, alkenylene heterocycloalkylene, alkenylene heterocycloalkyl alkenylene, alkylene heterocycloalkyl alkenylene, alkynylene heterocycloalkylene, alkynylene heterocycloalkyl alkynylene, cycloalkenylene, alkylene cycloalkenylene, alkylene cycloalkenylene alkylene, alkenylene cycloalkenylene, alkenylene cycloalkenylene alkenylene, alkylene cycloalkenylene alkenylene, alkynylene cycloalkenylene, alkynylene cycloalkenylene alkynylene, heterocycloalkenylene, alkylene heterocycloalkenylene, alkylene heterocycloalkenyl alkylene, alkenylene heterocycloalkenylene, alkenylene heterocycloalkenyl alkenylene, alkylene heterocycloalkenyl alkenylene, alkynylene heterocycloalkenylene, alkynylene heterocycloalkenyl alkynylene, arylene group, alkylene arylene group, alkylene arylene alkylene, alkenylene arylene group, alkenylene arylene alkenylene, alkylene arylene alkenylene, alkynylene arylene group, alkynylene arylene alkynylene, heteroarylene group, alkylene heteroarylene group, alkylene heteroarylene alkylene, alkenylene heteroarylene group, alkenylene heteroarylene alkenylene, alkylene heteroarylene alkenylene, alkynylene heteroarylene group, alkynylene heteroarylene alkynylene, 1,4-alkyl substituted piperazine, carbonyl group and thiocarbonyl group,
wherein the epoxy groups in the epoxy resin and the active hydrogen in the degradable amine and thiol curing agents have a molar ratio of 0.8-1.2, and
wherein the active hydrogen in the degradable amine curing agent and the active hydrogen in the degradable thiol curing agent have a molar ratio of 0.5-4.0.

2. The resin composition according to claim 1 , wherein the epoxy resin is anyone selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, isocyanate modified epoxy resin, o-cresol type epoxy resin, naphthalene type epoxy resin, alicyclic epoxy resin, resorcinol type epoxy resin, polyethylene glycol type epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, dicyclopentadiene type epoxy resin and phenolic type epoxy resin, or a mixture of at least two selected therefrom.

3. The resin composition according to claim 1 , wherein the inorganic filler is anyone selected from the group consisting of silica, alumina, magnesium oxide, aluminum hydroxide, magnesium hydroxide, boehmite, aluminum nitride, boron nitride, silicon carbide, titanium dioxide, kaolin, calcium carbonate and talc powder, or a mixture of at least two selected therefrom.

4. The resin composition according to claim 1 , wherein the inorganic filler is added in an amount of 0-30 parts by weight, based on 100 parts by weight of the resin composition comprising the inorganic filler.

5. A prepreg, wherein the prepreg comprises a reinforcing material and the resin composition according to claim 1 attached thereon after impregnation and drying.

6. A laminate, wherein the laminate comprises at least one prepreg according to claim 5 .

7. A copper clad laminate, wherein the copper clad laminate comprises at least one prepreg according to claim 5 and copper foil is pressed onto one or both sides of the prepreg.

8. A process for degrading the copper clad laminate claimed in claim 7 , the process comprising the following steps:
(1) etching copper foil from the copper foil laminate to obtain a copper recovery solution and a core plate from which the copper foil is etched;
(2) placing the core plate from which the copper foil is etched into an organic solvent, adjusting the pH to 4-6 with hydrochloric acid, holding at 100-140° C. for 2-4 h to completely degrade the resin composition to obtain a reinforcing material and a degradation solution, filtering and separating the degradation solution to obtain an inorganic filler and a resin solution; and
(3) adjusting the pH of the resin composition from the resin solution to 6-8 with sodium hydroxide or potassium hydroxide, precipitating the resin composition, filtering, drying to obtain a linear resin.

9. The resin composition according to claim 1 , wherein the degradable amine curing agent is:

and
wherein the degradable thiol curing agent is:

Assignees

• Shengyi Technology Co Ltd

Inventors

• Deng Huayang
• Huang Zengbiao
• Liu Qianfa
• Yang Zhongqiang
• Wang Peng

Classifications

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08J11/18

  by treatment with organic material · CPC title

• C08J11/16

  by treatment with inorganic material (C08J11/14 takes precedence) · CPC title

• C08J3/243 Primary

  Two or more independent types of crosslinking for one or more polymers · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title