Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same

Patent metadata

Field	Value
Publication number	US-11744013-B2
Application number	US-201715841439-A
Country	US
Kind code	B2
Filing date	Dec 14, 2017
Priority date	Mar 10, 2017
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite includes (1) from 20 to 70 parts by weight of a thermosetting mixture, including (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.

First claim

The invention claimed is:

1. A composite, wherein the composite comprises the following components:
(1) from 30 to 70 parts by weight of a thermosetting mixture, comprising:
(A) 75% to 95% by weight based on the total weight of components (A) and (B) of a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and
(B) 5% to 25% by weight based on the total weight of components (A) and (B) of an ethylene-propylene diene methylene rubber having a weight-average molecular weight of greater than 100,000 and less than 120,000 and a number-average molecular weight of greater than 60,000 and less than 80,000, having an ethylene ratio of 65% or more and being in a solid state at room temperature;

(2) from 10 to 60 parts by weight of a glass fiber cloth;
(3) from 0 to 70 parts by weight of a powder filler; and
(4) from 1 to 3 parts by weight of a curing initiator.

2. The composite claimed in claim 1 , wherein the thermosetting mixture, the weight of the component A is from 75% to 92% by weight of the total weight of the components A and B; and the weight of the component B is from 8% to 25% by weight of the total weight of the components A and B.

3. The composite claimed in claim 1 , wherein the thermosetting mixture further comprises other resin materials with unsaturated double bonds or unsaturated triple bonds.

4. The composite claimed in claim 3 , wherein the other resin materials with unsaturated double bonds or unsaturated triple bonds are selected from the group consisting of a cyanate resin, a vinyl or an acrylic group-terminated polyphenylene ether resin, an allylated polyphenylene ether resin, a bismaleimide resin and a vinyl-terminated silicone resin, or a mixture of at least two selected therefrom.

5. The composite claimed in claim 1 , wherein the powder filler is selected from the group consisting of a crystalline silica, a fused silica, a spherical silica, a titania, a strontium titanate, a barium titanate, a boron nitride, an aluminum nitride, a silicon carbide, an alumina, a glass fiber, a polytetrafluoroethylene, a polyphenylene sulfide and a polyethersulfone, or a mixture of at least two selected therefrom.

6. The composite claimed in claim 1 , wherein the curing initiator is selected from the group consisting of a dicumyl peroxide, a t-butyl peroxy benzoate and a 2,5-bis(2-ethylhexanoyl peroxide)-2,5-dimethylhexane, or a mixture of at least two selected therefrom.

7. The composite claimed in claim 1 , wherein the composite further comprises a bromine-containing or a phosphorus-containing flame retardant.

8. The composite claimed in claim 7 , wherein the bromine-containing flame retardant is selected from the group consisting of a decabromodiphenyl ether, a decabromodiphenyl ethane and an ethylene bistetrabromophthalimide, or a mixture of at least two selected therefrom.

9. The composite claimed in claim 7 , wherein the phosphorus-containing flame retardant is selected from the group consisting of a tri-(2,6-dimethylphenyl)phosphine, a 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, a 2,6-bis-(2,6-dimethylphenyl)-phosphinobenzene and a 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, or a mixture of at least two selected therefrom.

10. The composite claimed in claim 1 , wherein the composite further comprises an auxiliary crosslinking agent.

11. The composite claimed in claim 10 , wherein the auxiliary crosslinking agent is selected from the group consisting of a triallyl trimeric isocyanate, a triallyl cyanurate, a divinylbenzene and a polyfunctional acrylate, or a mixture of at least two selected therefrom.

12. A laminate prepared from the composite claimed in claim 1 , comprising a plurality of layers of superimposed prepregs, each of which is made of the composite.

13. A high-frequency circuit substrate prepared from the composite claimed in claim 1 , comprising a plurality of layers of superimposed prepregs and copper foils pressed on both sides thereof, wherein each of the prepregs is made of the composite.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Su Minshe
• Li Duye
• Yan Shanyin
• Liu Qianfa
• Yang Zhongqiang

Classifications

• H05K1/0373 Primary

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• B32B5/26 Primary

  another layer {next to it} also being fibrous or filamentary {(relative arrangement of fibres or filaments of different layers B32B5/12)} · CPC title

• B32B17/02

  in the form of fibres or filaments · CPC title

• B32B25/16

  comprising polydienes {homopolymers} or poly-halodienes {homopolymers (B32B25/12 takes precedence)} · CPC title

• C08J5/244

  using glass fibres · CPC title