Halogen-free epoxy resin composition, prepreg and laminate using same
US-2017283609-A1 · Oct 5, 2017 · US
Resin composition, prepreg containing same, laminate, and printed circuit board
US2022153989A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022153989-A1 |
| Application number | US-201917437555-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 8, 2019 |
| Priority date | Mar 18, 2019 |
| Publication date | May 19, 2022 |
| Grant date | — |
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- Title
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Abstract
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The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.
First claim
Opening claim text (preview).
1 . A resin composition, comprising: 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. 2 . The resin composition claimed in claim 1 , wherein the halogen-free epoxy resin is selected from the group consisting of a biphenyl novolac epoxy resin, a DCPD novolac epoxy resin, an alkylene novolac epoxy resin, a bisphenol A novolac epoxy resin, a bisphenol AP epoxy resin, a bisphenol TMC epoxy resin, and combinations thereof. 3 . The resin composition claimed in claim 1 , wherein the active ester resin is a compound represented by Formula (II) wherein X represents a phenyl group or a naphthyl group; j is 0 or 1; k is 0 or 1; n is 0.25-1.25. 4 . The resin composition claimed in claim 1 , wherein the active ester resin has a number average molecular weight of 800 or less. 5 . The resin composition claimed in claim 1 , wherein the resin composition further comprises a cyanate ester or a prepolymer thereof. 6 . The resin composition claimed in claim 1 , wherein the resin composition further comprises a curing accelerator. 7 . The resin composition claimed in claim 1 , wherein the resin composition further comprises flame retardant salts. 8 . The resin composition claimed in claim 1 , wherein the resin composition further comprises a filler. 9 . A prepreg obtained by impregnating or coating a reinforcing material with the resin composition claimed in claim 1 and semi-curing the same. 10 . A laminate comprising at least one sheet of the prepreg claimed in claim 9 . 11 . A printed circuit board comprising at least one sheet of the prepreg claimed in claim 9 . 12 . A printed circuit board comprising at least one sheet of the laminate claimed in claim 10 .
Assignees
Inventors
Classifications
characterised by the additives used in the prepolymer mixture · CPC title
using glass fibres · CPC title
- C08G59/4071Primary
phosphorus containing compounds · CPC title
- C08L63/00Primary
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
Epoxynovolacs · CPC title
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- What does patent US2022153989A1 cover?
- The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, lamina…
- Who is the assignee on this patent?
- Shengyi Technology Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08G59/4071. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu May 19 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).