Resin composition, prepreg containing same, laminate, and printed circuit board

Patent metadata

Field	Value
Publication number	US-12104054-B2
Application number	US-201917437555-A
Country	US
Kind code	B2
Filing date	Apr 8, 2019
Priority date	Mar 18, 2019
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

First claim

The invention claimed is:

1. A resin composition, comprising:
100 parts by weight of a halogen-free epoxy resin,
11-37 parts by weight of an active ester resin, and
40-66 parts by weight of a compound represented by Formula (I),

wherein n is 2-15; Ac represents an acetyl group;
wherein the active ester resin is a compound represented by Formula (II)

wherein X represents a phenyl group or a naphthyl group; j is 0 or 1; k is 0 or 1; n is 0.25-1.25;
wherein the active ester resin has a number average molecular weight of less than 800.

2. The resin composition claimed in claim 1 , wherein the halogen-free epoxy resin is selected from the group consisting of a biphenyl novolac epoxy resin, a dicyclopentadiene (DCPD) novolac epoxy resin, an alkylene novolac epoxy resin, a bisphenol A novolac epoxy resin, a bisphenol AP epoxy resin, a bisphenol TMC epoxy resin, and combinations thereof.

3. The resin composition claimed in claim 1 , wherein the resin composition further comprises a cyanate ester or a prepolymer thereof.

4. The resin composition claimed in claim 1 , wherein the resin composition further comprises a curing accelerator.

5. The resin composition claimed in claim 1 , wherein the resin composition further comprises flame retardant salts.

6. The resin composition claimed in claim 1 , wherein the resin composition further comprises a filler.

7. A prepreg obtained by impregnating or coating a reinforcing material with the resin composition claimed in claim 1 and semi-curing the same.

8. A laminate comprising at least one sheet of the prepreg claimed in claim 7 .

9. A printed circuit board comprising at least one sheet of the prepreg claimed in claim 7 .

10. A printed circuit board comprising at least one sheet of the laminate claimed in claim 8 .

Assignees

• Shengyi Technology Co Ltd

Inventors

• He Liexiang
• Qi Yongnian
• Zeng Xianping
• Yang Zhongqiang
• Pan Hualin

Classifications

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J5/244

  using glass fibres · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08L2201/02

  Flame or fire retardant/resistant · CPC title

• C08K5/0066

  Flame-proofing or flame-retarding additives · CPC title