Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same

Patent metadata

Field	Value
Publication number	US-2016185939-A1
Application number	US-201514680806-A
Country	US
Kind code	A1
Filing date	Apr 7, 2015
Priority date	Dec 29, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

The present invention relates to a halogen-free thermosetting resin composition and also a prepreg and a laminate for printed circuits prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent. The prepreg and laminate for printed circuits prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better processability, and can fulfill halogen-free flame retardancy and achieve UL94 V-0 grade.

First claim

1 . A halogen-free thermosetting resin composition, based on 100 parts by weight of organic solids, comprising:
(A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 20 to 50 parts by weight of a compound containing dihydrobenzoxazine ring, and (C) from 10 to 40 parts by weight of a phosphorus-containing bisphenol curing agent.

2 . The halogen-free thermosetting resin composition of claim 1 wherein the halogen-free epoxy resin is any one or a mixture of at least two selected from bisphenol-A epoxy resin, bisphenol-F epoxy resin, o-cresol novolac epoxy resin, bisphenol-A novolac epoxy resin, trisphenol novolac epoxy resin, dicyclopentadiene novolac epoxy resin, biphenyl novolac epoxy resin, alkylbenzene novolac epoxy resin and naphthol novolac epoxy resin.

3 . The halogen-free thermosetting resin composition of claim 1 wherein the halogen-free epoxy resin is selected from the epoxy resin having the following structure:

wherein X 1 , X 2 and X 3 are each independently selected from

R 1 is any one selected from hydrogen atom, substituted or unsubstituted C1-C5 linear alkyl, and substituted or unsubstituted C1-05 branched alkyl;
Y 1 and Y 2 are each independently any one selected from single bonds, —CH 2 —,

wherein m is any integer from 1 to 10; R 2 is any one selected from hydrogen atom, substituted or unsubstituted C1-05 linear alkyl, and substituted or unsubstituted C1-05 branched alkyl.

4 . The halogen-free thermosetting resin composition of claim 1 wherein the compound containing dihydrobenzoxazine ring is any one or a mixture of at least two selected from benzoxazine of formula (I) or formula (II), including bisphenol-A benzoxazine, bisphenol-F benzoxazine, MDA-type benzoxazine, phenolphthalein benzoxazine and dicyclopentadiene benzoxazine;

wherein, R 3 is selected from the group consisting of

5 . The halogen-free thermosetting resin composition of claim 1 wherein the phosphorus-containing bisphenol curing agent has the following structure:

wherein n is any integer from 2 to 20.

6 . The halogen-free thermosetting resin composition of claim 1 wherein the phosphorus-containing bisphenol curing agent has a weight average molecular weight of from 1000 to 6500.

7 . The halogen-free thermosetting resin composition of claim 1 wherein the halogen-free thermosetting resin composition further comprises (D) a curing accelerator.

8 . The halogen-free thermosetting resin composition of claim 7 wherein the curing accelerator is any one or a mixture of at least two selected from imidazole compounds, derivatives of imidazole compounds, piperidine compounds, Lewis acid and triphenylphosphine.

9 . The halogen-free thermosetting resin composition of claim 8 wherein the curing accelerator is any one or a mixture of at least two selected from 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole and triphenylphosphine.

10 . The halogen-free thermosetting resin composition of claim 7 wherein based on 100 parts by weight of the total addition amounts of components (A), (B) and (C), the component (D) is added in an amount of from 0.01 to 1 parts by weight.

11 . The halogen-free thermosetting resin composition of claim 1 wherein the halogen-free thermosetting resin composition further comprises (E) a filler.

12 . The halogen-free thermosetting resin composition of claim 11 wherein the filler is surface-treated inorganic filler.

13 . The halogen-free thermosetting resin composition of claim 12 wherein the surface-treated inorganic filler is surface-treated silica, and the surface-treated surface treating agent is any one or a mixture of at least two selected from a silane coupling agent, a silicone oligomer and a titanate coupling agent.

14 . The halogen-free thermosetting resin of claim 13 wherein based on 100 parts by weight of the inorganic filler, the surface treating agent is in an amount of from 0.1 to 5.0 parts by weight.

15 . The halogen-free thermosetting resin composition of claim 11 wherein the filler has a median particle diameter of from 0.01 to 50 μm.

16 . The halogen-free thermosetting resin composition of claim 11 wherein based on 100 parts by weight of the total addition amounts of components (A), (B) and (C), the component (E) is added in an amount of from 5 to 300 parts by weight.

17 . A prepreg comprising a reinforcing material and the halogen-free thermosetting resin composition of claim 1 which is attached thereon after impregnation and drying.

18 . A laminate comprising at least one prepreg according to claim 17 .

19 . The halogen-free thermosetting resin composition of claim 2 wherein the compound containing dihydrobenzoxazine ring is any one or a mixture of at least two selected from benzoxazine of formula (I) or formula (II), including bisphenol-A benzoxazine, bisphenol-F benzoxazine, MDA-type benzoxazine, phenolphthalein benzoxazine and dicyclopentadiene benzoxazine;

wherein, R 3 is selected from the group consisting of

Assignees

• Shengyi Technology Co Ltd

Inventors

• You Jiang
• Huang Tianhui
• Yang Zhongqiang

Classifications

• C08J5/24

  Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs · CPC title

• C08K3/36

  Silica · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08K5/357 Primary

  Six-membered rings · CPC title

• C08J5/249 Primary

  characterised by the additives used in the prepolymer mixture · CPC title