Composite, high-frequency circuit substrate prepared therefrom and process for preparing the same

Patent metadata

Field	Value
Publication number	US-2018263115-A1
Application number	US-201715841439-A
Country	US
Kind code	A1
Filing date	Dec 14, 2017
Priority date	Mar 10, 2017
Publication date	Sep 13, 2018
Grant date	—

Abstract

The present invention relates to a composite, a high-frequency circuit substrate prepared therefrom and a process for preparing the same. Such composite comprises (1) from 20 to 70 parts by weight of a thermosetting mixture, comprising (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator. The composite of the present invention has good solvent solubility and good process operability. The high-frequency circuit substrate made by using the composite has good high frequency dielectric properties and better thermal oxidative aging performance.

First claim

1 . A composite, wherein the composite comprises the following components:
(1) from 20 to 70 parts by weight of a thermosetting mixture, comprising: (A) a thermosetting resin based on polybutadiene or a copolymer resin of polybutadiene and styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups, and (B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature; (2) from 10 to 60 parts by weight of a glass fiber cloth; (3) from 0 to 70 parts by weight of a powder filler; and (4) from 1 to 3 parts by weight of a curing initiator.

2 . The composite claimed in claim 1 , wherein the ethylene-propylene rubber has a weight-average molecular weight of greater than 100,000 and less than 120,000 and a number-average molecular weight of greater than 60,000 and less than 80,000 and being in a solid state at room temperature.

3 . The composite claimed in claim 1 , wherein the ethylene-propylene rubber is selected from the group consisting of an ethylene-propylene methylene rubber, an ethylene-propylene diene methylene rubber, or a mixture thereof.

4 . The composite claimed in claim 1 , wherein the ethylene-propylene rubber is an ethylene-propylene diene methylene rubber.

5 . The composite claimed in claim 1 , wherein the ethylene-propylene rubber is an ethylene-propylene diene methylene rubber having an ethylene ratio of more than 65%.

6 . The composite claimed in claim 1 , wherein the thermosetting mixture, the weight of the component A is from 75% to 95% of the total weight of the components A and B; and the weight of the component B is from 5% to 25% of the total weight of the components A and B.

7 . The composite claimed in claim 1 , wherein the thermosetting mixture further comprises other resin materials with unsaturated double bonds or unsaturated triple bonds.

8 . The composite claimed in claim 7 , wherein the other resin materials with unsaturated double bonds or unsaturated triple bonds are anyone selected from the group consisting of a cyanate resin, a vinyl or an acrylic group-terminated polyphenylene ether resin, an allylated polyphenylene ether resin, a bismaleimide resin and a vinyl-terminated silicone resin, or a mixture of at least two selected therefrom.

9 . The composite claimed in claim 1 , wherein the powder filler is anyone selected from the group consisting of a crystalline silica, a fused silica, a spherical silica, a titanic, a strontium titanate, a barium titanate, a boron nitride, an aluminum nitride, a silicon carbide, an alumina, a glass fiber, a polytetrafluoroethylene, a polyphenylene sulfide and a polyethersulfone, or a mixture of at least two selected therefrom.

10 . The composite claimed in claim 1 , wherein the curing initiator is anyone selected from the group consisting of a dicumyl peroxide, a t-butyl peroxy benzoate and a 2,5-bis(2-ethylhexanoyl peroxide)-2,5-dimethylhexane, or a mixture of at least two selected therefrom.

11 . The composite claimed in claim 1 , wherein the composite further comprises a bromine-containing or a phosphorus-containing flame retardant.

12 . The composite claimed in claim 11 , wherein the bromine-containing flame retardant is anyone selected from the group consisting of a decabromodiphenyl ether, a decabromodiphenyl ethane and an ethylene bistetrabromophthalimide, or a mixture of at least two selected therefrom.

13 . The composite claimed in claim 11 , wherein the phosphorus-containing flame retardant is anyone selected from the group consisting of a tri-(2,6-dimethylphenyl)phosphine, a 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, a 2,6-bis-(2,6-dimethylphenyl)-phosphinobenzene and a 10-phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, or a mixture of at least two selected therefrom.

14 . The composite claimed in claim 1 , wherein the composite further comprises an auxiliary crosslinking agent.

15 . The composite claimed in claim 14 , wherein the auxiliary crosslinking agent is anyone selected from the group consisting of a triallyl trimeric isocyanate, a triallyl cyanurate, a divinylbenzene and a polyfunctional acrylate, or a mixture of at least two selected therefrom.

16 . A laminate prepared from the composite claimed in claim 1 , comprising a plurality of layers of superimposed prepregs, each of which is made of the composite.

17 . A high-frequency circuit substrate prepared from the composite claimed in claim 1 , comprising a plurality of layers of superimposed prepregs and copper foils pressed on both sides thereof, wherein each of the prepregs is made of the composite.

18 . A process for preparing the high-frequency circuit substrate claimed in claim 17 , comprising the following steps,
Step I weighing the following components of the composite,
(1) from 20 to 70 parts by weight of a thermosetting mixture, comprising:
(A) a thermosetting resin based on a polybutadiene or a copolymer resin of polybutadiene and a styrene having a molecular weight of 11,000 or less, being composed of carbon and hydrogen elements and containing 60% or more of vinyl groups; and
(B) an ethylene-propylene rubber having a weight-average molecular weight of greater than 100,000 and less than 150,000 and a number-average molecular weight of greater than 60,000 and less than 100,000 and being in a solid state at room temperature;
(2) from 10 to 60 parts by weight of a glass fiber cloth;
(3) from 0 to 70 parts by weight of a powder filler; and
(4) from 1 to 3 parts by weight of a curing initiator;
Step II mixing the weighed thermosetting mixture, powder filler and curing initiator, diluting with a solvent to a suitable viscosity, homogeneously stirring and mixing to make the powder filler dispersed in the thermosetting resin homogeneously to obtain a glue solution, impregnating the glass fiber cloth with the glue solution, controlling to a suitable thickness, and then removing the solvent to form a prepreg; Step III laminating a plurality of said prepregs, pressing a copper foil on the upper and bottom side thereof respectively, curing in a press at a curing temperature of 150° C-300° C. and a curing pressure of 25 kg/cm 2 -70 kg/cm 2 , to obtain the high-frequency circuit substrate.

Assignees

• Shengyi Technology Co Ltd

Inventors

• Su Minshe
• Li Duye
• Yan Shanyin
• Liu Qianfa
• Yang Zhongqiang

Classifications

• H05K1/0373 Primary

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K2201/0154

  Polyimide · CPC title

• H05K2201/0278

  Polymeric fibers · CPC title

• H05K1/0237

  High frequency adaptations (H05K1/0216 takes precedence) · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title