Release agent composition for light irradiation release, and adhesive composition for light irradiation release
US-2026098188-A1 · Apr 9, 2026 · US
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Yanai Masaki patents
Yanai Masaki is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Yanai Masaki |
| Total patents | 24 |
| First publication | Dec 29, 2022 |
| Latest publication | Apr 9, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-12545863-B2 · Feb 10, 2026 · US
Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling
US-12534693-B2 · Jan 27, 2026 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-12529018-B2 · Jan 20, 2026 · US
Method for producing processed semiconductor substrate
US-2025376645-A1 · Dec 11, 2025 · US
Adhesive composition for release by light irradiation, laminate, and method for producing processed semiconductor substrate
US-2025316522-A1 · Oct 9, 2025 · US
Adhesive containing polyether-modified siloxane
US-2025215294-A1 · Jul 3, 2025 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling composition
US-2025153225-A1 · May 15, 2025 · US
Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
US-12297381-B2 · May 13, 2025 · US
Adhesive composition, laminate, method for producing laminate, and method for producing processed substrate
US-2025092292-A1 · Mar 20, 2025 · US
Recent patents
Latest publications not already listed above.
Adhesive composition, laminate, and method for producing processed semiconductor substrate
US-2025084291-A1 · Mar 13, 2025 · US
Thermosetting composition
US-2025002685-A1 · Jan 2, 2025 · US
Adhesive composition, laminate, method of manufacturing laminate, and method of manufacturing processed substrate
US-2024199918-A1 · Jun 20, 2024 · US
Laminate and release agent composition
US-2023343629-A1 · Oct 26, 2023 · US
Multilayer body, release agent composition, and method for producing processed semiconductor substrate
US-2023298923-A1 · Sep 21, 2023 · US
Laminate, release agent composition, and method for manufacturing processed semiconductor substrate
US-2023265325-A1 · Aug 24, 2023 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-2023151306-A1 · May 18, 2023 · US
Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and release composition
US-2023151307-A1 · May 18, 2023 · US
Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling
US-2023151308-A1 · May 18, 2023 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and stripping composition
US-2023125907-A1 · Apr 27, 2023 · US
Cleaning agent composition and method for producing processed semiconductor substrate
US-2023129238-A1 · Apr 27, 2023 · US
Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling composition
US-2023131533-A1 · Apr 27, 2023 · US
Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling
US-2023131428-A1 · Apr 27, 2023 · US
Adhesive composition, laminate and method for producing same, method for peeling laminate, and method for processing semiconductor-forming substrate
US-2022411684-A1 · Dec 29, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Nissan Chemical Corp | 24 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09J183/04 | 22 |
| H10P72/744 | 19 |
| H10P72/7416 | 19 |
| C08G77/12 | 16 |
| C08G77/20 | 16 |