Adhesive composition, laminate, method for producing laminate, and method for producing processed substrate

Patent metadata

Field	Value
Publication number	US-2025092292-A1
Application number	US-202218726583-A
Country	US
Kind code	A1
Filing date	Dec 20, 2022
Priority date	Jan 6, 2022
Publication date	Mar 20, 2025
Grant date	—

Abstract

Provided is an adhesive composition including: a reaction product (X) of a solid polymer (x1) having a first functional group and a liquid chain compound (x2) having, at a chain terminal, a second functional group capable of reacting with the first functional group, the reaction product (X) having the first functional group or the second functional group; and a liquid crosslinking agent (Y) having the first functional group or the second functional group, provided that when the reaction product (X) has the first functional group, the liquid crosslinking agent (Y) has the second functional group, and when the reaction product (X) has the second functional group, the liquid crosslinking agent (Y) has the first functional group.

First claim

1 . An adhesive composition comprising:
a reaction product (X) of a solid polymer (x1) having a first functional group and a liquid chain compound (x2) having, at a chain terminal, a second functional group capable of reacting with the first functional group, the reaction product (X) having the first functional group or the second functional group; and a liquid crosslinking agent (Y) having the first functional group or the second functional group, provided that when the reaction product (X) has the first functional group, the liquid crosslinking agent (Y) has the second functional group, and when the reaction product (X) has the second functional group, the liquid crosslinking agent (Y) has the first functional group.

2 . The adhesive composition according to claim 1 , wherein
the solid polymer (x1) is a solid polyorganosiloxane having the first functional group, the liquid chain compound (x2) is a compound having the second functional group at a chain terminal and having a siloxane linkage, and the liquid crosslinking agent (Y) is a liquid polyorganosiloxane having the first functional group or the second functional group.

3 . The adhesive composition according to claim 1 , wherein
the first functional group is a C 2-40 alkenyl group, and the second functional group is a Si—H group.

4 . The adhesive composition according to claim 1 , wherein
the solid polymer (x1) is a polyorganosiloxane having a C 2-40 alkenyl group bonded to a silicon atom, the liquid chain compound (x2) is a compound (x21) having a Si—H group at a chain terminal and having a siloxane linkage, and the liquid crosslinking agent (Y) is a liquid polyorganosiloxane having a Si—H group.

5 . The adhesive composition according to claim 4 , wherein the compound (x21) is represented by the following formula (x21-1):

wherein R a s each independently represent a substituted or unsubstituted C 1-10 hydrocarbon group without any aliphatic unsaturated bond, and n represents an integer of 0 or more.

6 . The adhesive composition according to claim 1 , wherein a constituent ratio between the solid polymer (x1) and the liquid chain compound (x2) in the reaction product (X) is from 95:5 to 10:90 as a mass ratio (polymer (x1):compound (x2)).

7 . The adhesive composition according to claim 1 , wherein a mass ratio between the reaction product (X) and the liquid crosslinking agent (Y) (reaction product (X) liquid crosslinking agent (Y)) is from 99:1 to 60:40.

8 . A laminate comprising a first substrate, a second substrate, and an adhesive layer provided between the first substrate and the second substrate, wherein
the adhesive layer is a layer formed from the adhesive composition according to claim 1 .

9 . The laminate according to claim 8 , further comprising a release layer provided between the first substrate and the second substrate.

10 . The laminate according to claim 8 , wherein the first substrate is a substrate comprising a semiconductor, and the second substrate is a support substrate.

11 . A method for producing a laminate, comprising:
applying the adhesive composition according to claim 1 to form an adhesive coating layer that provides an adhesive layer; and attaching a first substrate and a second substrate under heating and increased pressure so that the first substrate and the second substrate are in contact with each other with the adhesive coating layer interposed therebetween.

12 . The method for producing a laminate according to claim 11 , further comprising, after the attaching step, heating the adhesive coating layer to form the adhesive layer.

13 . The method for producing a laminate according to claim 11 , further comprising applying a release agent composition to form a release agent coating layer that provides a release layer, wherein
the attaching under heating and increased pressure is performed so that the first substrate and the second substrate are in contact with each other with the release agent coating layer and the adhesive coating layer interposed therebetween.

14 . The method for producing a laminate according to claim 11 , wherein the first substrate is a substrate comprising a semiconductor, and the second substrate is a support substrate.

15 . A method for producing a processed substrate, comprising:
processing the first substrate of the laminate according to claim 8 ; and separating the first substrate processed in the first step from the second substrate.

Assignees

• Nissan Chemical Corp

Inventors

• Usui Yuki
• Okuno Takahisa
• Yanai Masaki
• Shinjo Tetsuya

Classifications

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P70/20

  Cleaning during device manufacture · CPC title