Sdk repair method and apparatus, terminal, device, system, and medium
US-2026003610-A1 · Jan 1, 2026 · US
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Xia Ji patents
Xia Ji is listed as an inventor on 74 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Xia Ji |
| Total patents | 74 |
| First publication | Mar 28, 2019 |
| Latest publication | Jan 1, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Three-dimensional memory devices having through array contacts and methods for forming the same
US-2025359048-A1 · Nov 20, 2025 · US
Method, apparatus, device, and storage medium for compatibility of SDK with access application
US-12399710-B2 · Aug 26, 2025 · US
Method, apparatus, device, and storage medium for compatibility of sdk with access application
US-2025199802-A1 · Jun 19, 2025 · US
Motor rotor, motor, power assembly, and electric apparatus
US-2024348116-A1 · Oct 17, 2024 · US
Motor, electric drive device, electric drive system, and electric apparatus
US-2024348129-A1 · Oct 17, 2024 · US
Electric drive assembly and electric device
US-2024344604-A1 · Oct 17, 2024 · US
Axial flux motor, electric device, and vehicle
US-2024322650-A1 · Sep 26, 2024 · US
Motor, stator, and manufacturing method of stator
US-2024322630-A1 · Sep 26, 2024 · US
Three-dimensional memory and fabrication method thereof
US-2024324224-A1 · Sep 26, 2024 · US
Recent patents
Latest publications not already listed above.
Memory cell structure of a three-dimensional memory device
US-12063780-B2 · Aug 13, 2024 · US
Three-dimensional memory and fabrication method thereof
US-12052871-B2 · Jul 30, 2024 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-12035530-B2 · Jul 9, 2024 · US
Accurate and robust visual object tracking approach for quadrupedal robots based on siamese network
US-2024161315-A1 · May 16, 2024 · US
Method for obtaining channel state information, apparatus, and computer storage medium
US-11943026-B2 · Mar 26, 2024 · US
Three-dimensional memory devices having through array contacts and methods for forming the same
US-2024032293-A1 · Jan 25, 2024 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-2024023333-A1 · Jan 18, 2024 · US
Three-dimensional memory device with source structure and methods for forming the same
US-11805650-B2 · Oct 31, 2023 · US
Contact structures having conductive portions in substrate in three-dimensional memory devices and methods for forming the same
US-11792980-B2 · Oct 17, 2023 · US
Three-dimensional memory device with source structure and methods for forming the same
US-11785772-B2 · Oct 10, 2023 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-2023301105-A1 · Sep 21, 2023 · US
Three-dimensional memory devices having through array contacts and methods for forming the same
US-2023255025-A1 · Aug 10, 2023 · US
Three-dimensional memory devices having through stair contacts and methods for forming the same
US-11716846-B2 · Aug 1, 2023 · US
Three-dimensional memory devices having through array contacts and methods for forming the same
US-11690219-B2 · Jun 27, 2023 · US
Three-dimensional memory device with source structure and methods for forming the same
US-11653495-B2 · May 16, 2023 · US
Three-dimensional memory devices having through array contacts and methods for forming the same
US-11581322-B2 · Feb 14, 2023 · US
Three-dimensional memory devices having through array contacts and methods for forming the same
US-11532636-B2 · Dec 20, 2022 · US
Structures and methods for reducing stress in three-dimensional memory device
US-11450770-B2 · Sep 20, 2022 · US
Three-dimensional memory device with source structure and methods for forming the same
US-11437398-B2 · Sep 6, 2022 · US
Method and apparatus for adjusting broadcast beam domain
US-11432165-B2 · Aug 30, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yangtze Memory Tech Co Ltd | 61 |
| Contemporary Amperex Intelligence Tech Shanghai Limited | 4 |
| Contemporary Amperex Technology Co Ltd | 4 |
| Huawei Tech Co Ltd | 4 |
| China Unionpay Co Ltd | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10B43/27 | 61 |
| H10B43/35 | 47 |
| H01L27/11582 | 45 |
| H10W20/056 | 42 |
| H01L21/76877 | 42 |