Electronic device having substrate
US-12557672-B2 · Feb 17, 2026 · US
This page is not indexed by search engines while we improve data quality.
Wu Shih-Hsien patents
Wu Shih-Hsien is listed as an inventor on 36 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu Shih-Hsien |
| Total patents | 36 |
| First publication | Apr 9, 2015 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Characteristic impedance control structure
US-2026040434-A1 · Feb 5, 2026 · US
Repackaging structure
US-2025210498-A1 · Jun 26, 2025 · US
Multi-die integrated package design method and system using the same
US-2025139349-A1 · May 1, 2025 · US
Power design architecture
US-2024220694-A1 · Jul 4, 2024 · US
Electronic device having substrate with electrically floating vias
US-11955417-B2 · Apr 9, 2024 · US
Electronic device having substrate
US-11756865-B2 · Sep 12, 2023 · US
Electronic device having substrate
US-2023187332-A1 · Jun 15, 2023 · US
Electronic device having substrate
US-2023187361-A1 · Jun 15, 2023 · US
Circuit structure
US-11469484-B2 · Oct 11, 2022 · US
Recent patents
Latest publications not already listed above.
Fabrication method of flexible electronic package device
US-2022201870-A1 · Jun 23, 2022 · US
Fabrication method of flexible electronic package device
US-11363724-B1 · Jun 14, 2022 · US
Lead frame package
US-11239141-B2 · Feb 1, 2022 · US
Lead frame package
US-2022005754-A1 · Jan 6, 2022 · US
Electronic device having substrate
US-2021257279-A1 · Aug 19, 2021 · US
Reconfigurable data bus system and method thereof
US-11061694-B2 · Jul 13, 2021 · US
Circuit structure
US-2021203052-A1 · Jul 1, 2021 · US
Reconfigurable data bus system and method thereof
US-2020142713-A1 · May 7, 2020 · US
Circuit structure
US-10448501-B2 · Oct 15, 2019 · US
Differential signal transmitting circuit board
US-10405418-B2 · Sep 3, 2019 · US
Electromagnetic wave transmission board and differential electromagnetic wave transmission board
US-10276908-B2 · Apr 30, 2019 · US
Electromagnetic wave transmission board and differential electromagnetic wave transmission board
US-2018183127-A1 · Jun 28, 2018 · US
Differential signal transmitting circuit board
US-2018177044-A1 · Jun 21, 2018 · US
Semiconductor device having a rib structure and manufacturing method of the same
US-2018033772-A1 · Feb 1, 2018 · US
Signal transmission board and method for manufacturing the same
US-9706656-B2 · Jul 11, 2017 · US
Semiconductor device and manufacturing method of the same
US-2017170146-A1 · Jun 15, 2017 · US
Circuit structure
US-2017019994-A1 · Jan 19, 2017 · US
Signal transmission board and method for manufacturing the same
US-2016174360-A1 · Jun 16, 2016 · US
Semiconductor substrate assembly with embedded resistance element
US-9343393-B2 · May 17, 2016 · US
Via structure
US-9258883-B2 · Feb 9, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ind Tech Res Inst | 36 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0251 | 11 |
| H10W90/724 | 11 |
| H10W90/701 | 11 |
| H10W90/00 | 11 |
| H10W70/635 | 10 |