Circuit structure

Patent metadata

Field	Value
Publication number	US-10448501-B2
Application number	US-201514968021-A
Country	US
Kind code	B2
Filing date	Dec 14, 2015
Priority date	Jul 17, 2015
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A circuit structure includes an annular conductor, a conductive via and at least one extension conductor. The annular conductor extends along a direction. The conductive via is disposed in the annular conductor and extending along the direction. The at least one extension conductor is electrically connected to at least one end of the annular conductor and extending toward the conductive via.

First claim

What is claimed is:

1. A circuit structure, comprising:
an annular conductor extending along a direction;
a core substrate penetrated by the annular conductor;
a conductive via disposed in the annular conductor and extending along the direction;
at least one extension conductor electrically connected to at least one end of the annular conductor and extending toward the conductive via;
at least one conductive layer electrically connected to the at least one extension conductor; and
at least one conductive line disposed on the core substrate, the at least one conductive line electrically connected to at least one end of the conductive via and electrically insulated from the annular conductor, the at least one conductive layer and the at least one extension conductor;
wherein an orthogonal projection of the at least one extension conductor on the core substrate and an orthogonal projection of the at least one conductive line on the core substrate are partially overlapped with each other;
wherein a height of the at least one extension conductor from at least one surface of the core substrate is less than a height of the conductive via from the at least one surface of the core substrate.

2. The circuit structure according to claim 1 , wherein the at least one extension conductor is electrically insulated from the conductive via.

3. The circuit structure according to claim 1 , wherein the at least one extension conductor is electrically connected to the conductive via.

4. The circuit structure according to claim 1 , further comprising a dielectric element disposed between the conductive via and the annular conductor.

5. The circuit structure according to claim 4 , wherein a dielectric constant of the dielectric element is from 1 to 6.

6. The circuit structure according to claim 1 , wherein the at least one extension conductor and the annular conductor are electrically connected to a reference potential.

7. The circuit structure according to claim 1 , further comprising:
at least one insulating layer disposed on the core substrate, and the at least one conductive line disposed on the at least one insulating layer.

8. A circuit structure, comprising:
a conductive via extending along a direction;
a first arcuate conductor disposed at one side of the conductive via, and the first arcuate conductor electrically insulated from the conductive via;
a core substrate penetrated by the first arcuate conductor;
at least one extension conductor electrically connected to at least one end of the first arcuate conductor and extending toward the conductive via;
at least one conductive layer electrically connected to the at least one extension conductor; and
at least one conductive line disposed on the core substrate, the at least one conductive line electrically connected to at least one end of the conductive via and electrically insulated from the first arcuate conductor, the at least one conductive layer and the at least one extension conductor;
wherein an orthogonal projection of the at least one extension conductor on the core substrate and an orthogonal projection of the at least one conductive line on the core substrate are partially overlapped with each other;
wherein a height of the at least one extension conductor from at least one surface of the core substrate is less than a height of the conductive via from the at least one surface of the core substrate.

9. The circuit structure according to claim 8 , wherein the at least one extension conductor is electrically insulated from the conductive via.

10. The circuit structure according to claim 8 , wherein the at least one extension conductor is electrically connected to the conductive via.

11. The circuit structure according to claim 8 , further comprising a second arcuate conductor disposed at another side of the conductive via, and the second arcuate conductor electrically insulated from the first arcuate conductor.

12. The circuit structure according to claim 8 , further comprising a dielectric element surrounding the conductive via, the conductive via having two ends that are opposite to each other and exposed, and the dielectric element located between the conductive via and the first arcuate conductor.

13. The circuit structure according to claim 12 , wherein a dielectric constant of the dielectric element is from 1 to 6.

14. The circuit structure according to claim 8 , wherein the first arcuate conductor and the at least one extension conductor are electrically connected to a reference potential.

15. The circuit structure according to claim 8 , wherein the at least one conductive layer is disposed on the at least one surface of the core substrate, and the at least one conductive layer is electrically connected to at least one end of the first arcuate conductor and the at least one extension conductor.

16. The circuit structure according to claim 15 , wherein the at least one conductive layer comprises a first conductive layer and a second conductive layer, the first conductive layer is disposed on the at least one surface of the core substrate, and the second conductive layer is disposed on a part of the first conductive layer.

17. The circuit structure according to claim 8 , further comprising:
at least one insulating layer disposed on the core substrate, and the at least one conductive line disposed on the at least one insulating layer.

18. The circuit structure according to claim 1 , wherein the at least one conductive layer is disposed on the at least one surface of the core substrate, and the at least one conductive layer is electrically connected to the at least one end of the annular conductor.

19. The circuit structure according to claim 18 , wherein the at least one conductive layer comprises a first conductive layer and a second conductive layer, the first conductive layer is disposed on the at least one surface of the core substrate, and the second conductive layer is disposed on a part of the first conductive layer.

Assignees

• Ind Tech Res Inst

Inventors

• Wu Shih-Hsien

Classifications

• H05K2201/0959

  Plated through-holes or plated blind vias filled with insulating material · CPC title

• H05K2201/09536

  Buried plated through-holes, i.e. plated through-holes formed in a core before lamination · CPC title

• H05K1/0251 Primary

  related to vias or transitions between vias and transmission lines · CPC title

• H05K2201/09563

  Metal filled via · CPC title

• H05K3/4602

  characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated · CPC title