Lead frame package

Patent metadata

Field	Value
Publication number	US-2022005754-A1
Application number	US-202017031486-A
Country	US
Kind code	A1
Filing date	Sep 24, 2020
Priority date	Jul 3, 2020
Publication date	Jan 6, 2022
Grant date	—

Abstract

A lead frame package including first conductive layer, first electronic component, lead frames, second conductive layer and package body. First conductive layer has conductive carriers. First electronic component has first pins. Lead frames and first pins are respectively electrically connected to conductive carriers. Second conductive layer has conductive joints respectively electrically connected to lead frames so as to be electrically connected to at least a part of conductive carriers via lead frames. Package body encapsulates first conductive layer, first electronic component, and lead frames. First conductive layer and second conductive layer are located on two opposite sides of first electronic component, respectively.

First claim

What is claimed is:

1 . A lead frame package, comprising:
a first conductive layer having a plurality of conductive carriers; a first electronic component having a plurality of first pins; a plurality of lead frames, wherein the plurality of lead frames and the plurality of first pins of the first electronic component are respectively electrically connected to the plurality of conductive carriers of the first conductive layer; a second conductive layer having a plurality of conductive joints respectively electrically connected to the plurality of lead frames so as to be electrically connected to at least a part of the plurality of conductive carriers of the first conductive layer via the plurality of lead frames; and a package body, encapsulating the first conductive layer, the first electronic component, and the plurality of lead frames; wherein the first conductive layer and the second conductive layer are located on two opposite sides of the first electronic component, respectively.

2 . The lead frame package according to claim 1 , wherein at least a part of the plurality of conductive carriers of the first conductive layer is exposed, and at least a part of the plurality of conductive joints of the second conductive layer is exposed.

3 . The lead frame package according to claim 1 , wherein at least a part of the plurality of first pins of the first electronic component and at least a part of the plurality of lead frames are connected to one of the plurality of the conductive carriers of the first conductive layer, and another part of the plurality of first pins of the first electronic component and another part of the plurality of lead frames are electrically connected to different ones of the plurality of conductive carriers of the first conductive layer, respectively.

4 . The lead frame package according to claim 3 , further comprising a circuit board, wherein the first conductive layer is formed on the circuit board, the circuit board has a plurality of inner lines, and at least some of the plurality of conductive carriers are electrically connected via the first conductive layer and the plurality of inner lines.

5 . The lead frame package according to claim 1 , wherein the plurality of first pins of the first electronic component and the plurality of lead frames are electrically connected to different ones of the plurality of conductive carriers of the first conductive layer, respectively.

6 . The lead frame package according to claim 5 , further comprising a circuit board, wherein the first conductive layer is formed on the circuit board, the circuit board has a plurality of inner lines, and the plurality of first pins of the first electronic component and the plurality of lead frames are electrically connected via the plurality of inner lines, respectively.

7 . The lead frame package according to claim 4 , further comprising a third conductive layer, wherein the third conductive layer is formed on a side of the circuit board located away from the first conductive layer and has a plurality of outer conductive joints, and the plurality of outer conductive joints of the third conductive layer are electrically connected to the plurality of conductive carriers of the first conductive layer via the plurality of inner lines, respectively.

8 . The lead frame package according to claim 6 , further comprising a third conductive layer, wherein the third conductive layer is formed on a side of the circuit board located away from the first conductive layer and has a plurality of outer conductive joints, and the plurality of outer conductive joints of the third conductive layer are electrically connected to the plurality of conductive carriers of the first conductive layer via the plurality of inner lines, respectively.

9 . The lead frame package according to claim 4 , further comprising a third conductive layer, wherein the third conductive layer is formed on a side of the circuit board located away from the first conductive layer and has a plurality of outer conductive joints, and at least a part of the plurality of outer conductive joints of the third conductive layer are electrically connected to the second conductive layer only via the plurality of lead frames and the plurality of inner lines.

10 . The lead frame package according to claim 6 , further comprising a third conductive layer, wherein the third conductive layer is formed on a side of the circuit board located away from the first conductive layer and has a plurality of outer conductive joints, and at least a part of the plurality of outer conductive joints of the third conductive layer are electrically connected to the second conductive layer only via the plurality of lead frames and the plurality of inner lines.

11 . The lead frame package according to claim 4 , further comprising a third conductive layer, wherein the third conductive layer is formed on a side of the circuit board located away from the first conductive layer and has a plurality of outer conductive joints, and at least a part of the plurality of outer conductive joints of the third conductive layer are electrically connected to the second conductive layer only via the plurality of lead frames.

12 . The lead frame package according to claim 6 , further comprising a third conductive layer, wherein the third conductive layer is formed on a side of the circuit board located away from the first conductive layer and has a plurality of outer conductive joints, and at least a part of the plurality of outer conductive joints of the third conductive layer are electrically connected to the second conductive layer only via the plurality of lead frames.

13 . The lead frame package according to claim 1 , wherein the plurality of lead frames are electrically connected to the plurality of conductive carriers of the first conductive layer via a plurality of soldering structures, respectively.

14 . The lead frame package according to claim 1 , wherein the plurality of lead frames are electrically connected to the plurality of conductive carriers of the first conductive layer via a plurality of conductive pillars and a plurality of soldering structures, respectively.

15 . The lead frame package according to claim 1 , wherein the plurality of lead frames comprises a plurality of first lead frames and a plurality of second lead frames, and the plurality of first lead frames and the plurality of second lead frames are located on two opposite sides of the first electronic component, respectively.

16 . The lead frame package according to claim 15 , wherein at least a part of the plurality of first lead frames and at least a part of the plurality of second lead frames are exposed on two opposite sides of the package body, respectively.

17 . The lead frame package according to claim 16 , wherein the package body has a first side surface, a second side surface, a third side surface, and a fourth side surface, the first side surface and the second side surface are located opposite to each other, the third side surface and the fourth side surface are located opposite to each other, the third side surface and the fourth side surface are located between the first side surface and the second side surface, at least a part of the plurality of conductive carriers of the first conductive layer is exposed from the first side surface of the package body, at least a part of the plurality of conductive joints of the second conductive layer is exposed from the second side surface of the package body, at least a part of the plurality of first lead frames is exposed from t

Assignees

• Ind Tech Res Inst

Inventors

• Cheng Ren-Shin
• Wu Shih-Hsien
• Huang Yu-Wei
• Shen Chih Ming
• Tsai Yi-Chieh

Classifications

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W70/465

  Bumps or wires · CPC title

• H10W70/456

  Materials · CPC title

• H10W70/427

  Bent parts · CPC title

• H10W90/811

  Multiple chips on leadframes · CPC title