Circuit structure

Patent metadata

Field	Value
Publication number	US-11469484-B2
Application number	US-202016821283-A
Country	US
Kind code	B2
Filing date	Mar 17, 2020
Priority date	Dec 31, 2019
Publication date	Oct 11, 2022
Grant date	Oct 11, 2022

Abstract

A circuit structure includes a substrate integrated waveguide, a substrate disposed on the substrate integrated waveguide, a waveguide signal feeding element and a ring-shaped conductive element. The substrate integrated waveguide includes another substrate having a waveguide transmitting region, two conductive layers disposed on this substrate and covering the waveguide transmitting region, and at least one waveguide conductive element passing through this substrate and electrically connected to the two conductive layers. The at least one waveguide conductive element surrounds the waveguide transmitting region. One of the conductive layers is located between the two substrates. The waveguide signal feeding element passes through one substrate and one conductive layer between the substrates, and the waveguide signal feeding element extends to the waveguide transmitting region. The waveguide signal feeding element is electrically insulated from one conductive layer. The ring-shaped conductive element is disposed in one substrate and surrounds the waveguide signal feeding element.

First claim

What is claimed is:

1. A circuit structure, comprising:
a substrate integrated waveguide, comprising:
a first substrate having a waveguide transmitting region;
a first conductive layer and a second conductive layer disposed on opposite surfaces of the first substrate, respectively, and covering the waveguide transmitting region; and
at least one waveguide conductive element passing through the first substrate and electrically connected to the first conductive layer and the second conductive layer, wherein the at least one waveguide conductive element surrounds the waveguide transmitting region;

a second substrate disposed on the substrate integrated waveguide, wherein the second conductive layer is located between the first substrate and the second substrate;
a waveguide signal feeding element passing through the second substrate and the second conductive layer, the waveguide signal feeding element extending to the waveguide transmitting region of the first substrate, wherein the waveguide signal feeding element is electrically insulated from the second conductive layer; and
a ring-shaped conductive element disposed in the second substrate and entirely surrounding the waveguide signal feeding element, wherein the ring-shaped conductive element has an inner surface and an outer surface, each of the inner surface and the outer surface is a continuous surface, and a perimeter of the outer surface is larger than a perimeter of the inner surface,
wherein the circuit structure further comprises a third conductive layer and an insulating layer, the third conductive layer is disposed between the second conductive layer and the second substrate, the insulating layer is disposed between the second conductive layer and the third conductive layer, the ring-shaped conductive element is electrically connected to the third conductive layer, the ring-shaped conductive element and the second conductive layer are spaced apart from each other by the insulating layer, the waveguide signal feeding element passes through the third conductive layer and the insulating layer, and the waveguide signal feeding element is electrically insulated from the third conductive layer.

2. The circuit structure according to claim 1 , further comprising a top conductive layer disposed on the second substrate, wherein the second substrate is located between the second conductive layer and the top conductive layer, the top conductive layer is electrically connected to the ring-shaped conductive element, and the waveguide signal feeding element is electrically insulated from the top conductive layer.

3. The circuit structure according to claim 2 , wherein the top conductive layer has an opening, the waveguide signal feeding element passes through the opening, and an inner diameter of the opening is smaller than an inner diameter of the ring-shaped conductive element.

4. The circuit structure according to claim 1 , wherein the second conductive layer has an opening, the waveguide signal feeding element passes through the opening, and an inner diameter of the opening is smaller than an inner diameter of the ring-shaped conductive element.

5. The circuit structure according to claim 1 , wherein the third conductive layer has an opening, the waveguide signal feeding element passes through the opening, and an inner diameter of the opening is smaller than an inner diameter of the ring-shaped conductive element.

6. The circuit structure according to claim 1 , wherein the first substrate has a first dielectric coefficient, the second substrate has a second dielectric coefficient, the insulating layer has a third dielectric coefficient, and the third dielectric coefficient is different from the first dielectric coefficient and the second dielectric coefficient.

7. The circuit structure according to claim 1 , wherein the ring-shaped conductive element is electrically connected to the second conductive layer.

8. The circuit structure according to claim 1 , wherein a portion of the waveguide signal feeding element extending into the first substrate has a length smaller than a thickness of the first substrate.

9. The circuit structure according to claim 1 , wherein the waveguide signal feeding element passes through the first substrate, and the waveguide signal feeding element is electrically insulated from the first conductive layer.

10. The circuit structure according to claim 1 , wherein the waveguide signal feeding element passes through the first substrate, and the waveguide signal feeding element is electrically connected to the first conductive layer.

11. The circuit structure according to claim 1 , wherein a quantity of the at least one waveguide conductive element is plural, and the waveguide conductive elements are spaced apart from each other and together surround the waveguide transmitting region.

12. The circuit structure according to claim 1 , wherein a quantity of the at least one waveguide conductive element is one, and the waveguide conductive element surrounds the waveguide transmitting region.

13. The circuit structure according to claim 1 , wherein the first substrate has a first dielectric coefficient, the second substrate has a second dielectric coefficient, and the first dielectric coefficient is equal to the second dielectric coefficient.

Assignees

• Ind Tech Res Inst

Inventors

• Ding Hsiang En
• Wu Shih-Hsien

Classifications

• H01P5/103 Primary

  Hollow-waveguide/coaxial-line transitions · CPC title

• H01P3/121

  integrated in a substrate · CPC title

• H01P11/003

  Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

• H01P3/18 Primary

  built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers · CPC title

• H01P3/081 Primary

  Microstriplines · CPC title