Fabrication method of flexible electronic package device

Patent metadata

Field	Value
Publication number	US-2022201870-A1
Application number	US-202017126033-A
Country	US
Kind code	A1
Filing date	Dec 18, 2020
Priority date	Dec 18, 2020
Publication date	Jun 23, 2022
Grant date	—

Abstract

A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion.

First claim

1 - 11 . (canceled)

12 . A fabrication method of a flexible electronic package device, comprising:
obtaining a minimum surface curvature radius of a selected portion of an applied carrier; determining a flexible electronic package device to be disposed on the selected portion according to the minimum surface curvature radius, wherein the flexible electronic package device comprises a plurality of members, and a method of determining the flexible electronic package device comprises: setting an initial bending radius, and calculating a curving stress value of each of the members in the flexible electronic package device at the initial bending radius, wherein the initial bending radius is smaller than the minimum surface curvature radius; determining a tolerable maximum stress value of each of the members; and determining as the flexible electronic package device disposed on the selected portion when the curving stress value of each of the members is smaller than or equal to the tolerable maximum stress value; and disposing the flexible electronic package device on the selected portion.

13 . The fabrication method of the flexible electronic package device according to claim 12 , wherein the applied carrier is a three-dimensional object.

14 . The fabrication method of the flexible electronic package device according to claim 12 , wherein the members comprise a first flexible carrier board and an electronic component bonded to the first flexible carrier board.

15 . The fabrication method of the flexible electronic package device according to claim 14 , wherein the members further comprise a second flexible carrier board, the first flexible carrier board is bonded onto the second flexible carrier board, and a size of the second flexible carrier board is larger than a size of the first flexible carrier board.

16 . The fabrication method of the flexible electronic package device according to claim 15 , wherein the members further comprise a sensing electrode, the sensing electrode is disposed on the second flexible carrier board, and a material of the sensing electrode comprises a biocompatible material.

17 . The fabrication method of the flexible electronic package device according to claim 15 , wherein the sensing electrode is located on an outer side of the second flexible carrier board away from the first flexible carrier board.

18 . The fabrication method of the flexible electronic package device according to claim 12 , wherein the applied carrier comprises a wearable object.

19 . The fabrication method of the flexible electronic package device according to claim 18 , wherein the wearable object comprises a headband, clothes, pants, or a shoe.

20 . The fabrication method of the flexible electronic package device according to claim 18 , wherein a method of obtaining the minimum surface curvature radius of the selected portion of the applied carrier comprises scanning the selected portion of the applied carrier in a worn state to obtain surface curvature radius of individual surfaces in the selected portion, and selecting a smallest one from the surface curvature radius as the minimum surface curvature.

Assignees

• Ind Tech Res Inst

Inventors

• Hsu Chien-Min
• Shen Chih-Ming
• Wu Shih-Hsien

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W70/688 Primary

  Flexible insulating substrates · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title