Metallized glass substrate and method for manufacturing the same
US-2026048573-A1 · Feb 19, 2026 · US
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Wei Tzu-Chien patents
Wei Tzu-Chien is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wei Tzu-Chien |
| Total patents | 24 |
| First publication | Jun 9, 2016 |
| Latest publication | Feb 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Perovskite solar cell and method for manufacturing the same
US-12532651-B2 · Jan 20, 2026 · US
Carrier-attached ultra-thin copper foil and manufacturing method thereof
US-2025287508-A1 · Sep 11, 2025 · US
Composite electrode structure and method for manufacturing the same
US-2024155854-A1 · May 9, 2024 · US
Perovskite solar cell and method for manufacturing the same
US-2024155932-A1 · May 9, 2024 · US
Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
US-11865518-B2 · Jan 9, 2024 · US
Conductive laminate and method for manufacturing the same
US-11745469-B2 · Sep 5, 2023 · US
Conductive laminate and method for manufacturing the same
US-2022242093-A1 · Aug 4, 2022 · US
Diffusion barrier structure, and conductive laminate and manufacturing method thereof
US-11331883-B2 · May 17, 2022 · US
Inspection method for multilayer semiconductor device
US-11313670-B2 · Apr 26, 2022 · US
Recent patents
Latest publications not already listed above.
Inspection method for multilayer semiconductor device
US-2022099432-A1 · Mar 31, 2022 · US
Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
US-11098407-B2 · Aug 24, 2021 · US
Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate
US-2021046455-A1 · Feb 18, 2021 · US
Method for preparing perovskite crystal
US-10883193-B2 · Jan 5, 2021 · US
Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrate
US-10828624-B2 · Nov 10, 2020 · US
Diffusion barrier structure, and conductive laminate and manufacturing method thereof
US-2020101699-A1 · Apr 2, 2020 · US
Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
US-2020002817-A1 · Jan 2, 2020 · US
Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrate
US-2019118165-A1 · Apr 25, 2019 · US
Method for preparing perovskite crystal
US-2018334759-A1 · Nov 22, 2018 · US
Substrate surface metallization method and substrate having metallized surface manufactured by the same
US-9875984-B2 · Jan 23, 2018 · US
Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
US-2017081766-A1 · Mar 23, 2017 · US
Substrate surface metallization method and substrate having metallized surface manufactured by the same
US-2017077059-A1 · Mar 16, 2017 · US
Substrate surface metallization method and substrate having metallized surface manufactured by the same
US-9514965-B2 · Dec 6, 2016 · US
Substrate surface metallization method and substrate having metallized surface manufactured by the same
US-2016163567-A1 · Jun 9, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Nat Tsing Hua | 20 |
| Nat Univ Tsing Hua | 4 |
| Unimicron Technology Corp | 1 |
| Chang Chun Plastics Co Ltd | 1 |
| Chang Chun Petrochemical Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C18/1893 | 7 |
| B01J35/45 | 6 |
| B01J35/23 | 6 |
| B01J23/44 | 6 |
| C23C18/1653 | 6 |