Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate

Patent metadata

Field	Value
Publication number	US-11865518-B2
Application number	US-202017075130-A
Country	US
Kind code	B2
Filing date	Oct 20, 2020
Priority date	Oct 20, 2017
Publication date	Jan 9, 2024
Grant date	Jan 9, 2024

Abstract

The instant disclosure provides a method for manufacturing an electroless plating substrate and a method for forming a metal layer on a surface of a substrate. The method for preparing the electroless plating substrate includes: providing a substrate; attaching a self-adsorbed catalyst composition to a surface of the substrate; and performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate. The self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound. The colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle. The silane compound has at least one amino group to interact with the colloidal nanoparticle. A covalent bond between the silane compound and the surface of the substrate is formed through the at least one silane group of the silane compound. The colloid nanoparticle has a particle size ranging from 5 to 10 nanometers.

First claim

What is claimed is:

1. A method for manufacturing an electroless plating substrate, including:
providing a substrate;
attaching a self-adsorbed catalyst composition to a surface of the substrate, wherein the self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound, the colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle, and the silane compound has at least one amino group to interact with the colloidal nanoparticle, a covalent bond between the silane compound and the surface of the substrate is formed through a silane group of the silane compound, and the colloid nanoparticle has a particle size ranging from 5 to 10 nanometers; and
performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate.

2. The method according to claim 1 , wherein, the step of attaching the self-adsorbed catalyst composition to the surface of the substrate further includes: immersing the substrate into a solution containing the self-adsorbed catalyst composition.

3. The method according to claim 2 , wherein the method further includes: the substrate is pre-treated by sulfuric acid and then immersed into the solution containing the self-adsorbed catalyst composition.

4. The method according to claim 1 , wherein the capping agent is selected from the group consisting of polyethamine capped by trimethoxysilyl, polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, and any combination thereof.

5. The method according to claim 1 , wherein the silane compound is selected from the group consisting of: (3-aminopropyl)triethoxysilane, N-aminoethyl-3-(3-aminopropyl)triethoxysilane, N-(6-aminohexyl) aminomethyltriethoxysilane, 3-[2-(2-aminoethylamino)ethylamino]propyl-trimethoxysilane, N-(2-aminoethyl-3-aminopropyl)trimethoxysilane and any combination thereof.

6. The method according to claim 1 , wherein the silane compound has 1 to 3 amino groups.

7. The method according to claim 1 , wherein the self-adsorbed catalyst composition is prepared by steps of:
providing a colloidal nanoparticle solution including the colloidal nanoparticle and a solvent;
mixing the colloidal nanoparticle solution with the silane compound for forming the self-adsorbed catalyst composition.

8. The method according to claim 7 , wherein the colloidal nanoparticle solution is prepared by a wet process, and the wet process includes steps of:
dissolving a metal precursor in the solvent to form a solution;
adding the capping agent into the solution for enabling the capping agent enclosing the metal precursor; and
reducing the metal precursor by a reducing agent to obtain the colloidal nanoparticle solution.

9. The method according to claim 8 , wherein a weight ratio between the metal precursor and the capping agent ranges from about 1:1 to 1:5.

10. The method according to claim 7 , wherein the colloidal nanoparticle is presented in the colloidal nanoparticle solution in an amount of from 50 to 200 ppm.

11. The method according to claim 7 , wherein the silane compound is presented in an amount of from 0.5 to 5 vol. % based on the total volume of the colloidal nanoparticle solution and the silane compound.

12. The method according to claim 7 , wherein the step of mixing the colloidal nanoparticle solution with the silane compound further includes stirring the colloidal nanoparticle solution and the silane compound for a time ranging from 1.5 to 4.5 hours.

13. The method according to claim 1 , wherein the electroless metal layer is a nickel metal layer.

14. A method for manufacturing an electroless plating substrate, including:
providing a substrate;
attaching a self-adsorbed catalyst composition to a surface of the substrate, wherein the self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound, the colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle, and the silane compound has at least one amino group, and the colloid nanoparticle has a particle size ranging from 5 to 10 nanometers; and
performing an electroless metal deposition for forming an electroless metal layer on the surface of the substrate.

15. The method according to claim 14 , wherein the method further includes: the substrate is pre-treated by sulfuric acid and then immersed into a solution containing the self-adsorbed catalyst composition; wherein the self-adsorbed catalyst composition is formed by mixing a colloidal nanoparticle solution and the silane compound.

16. The method according to claim 15 , wherein the silane compound is presented in an amount of from 0.5 to 5 vol. % based on the total volume of the colloidal nanoparticle solution and the silane compound.

17. A method for forming a metal layer on a surface of a substrate, including:
attaching a self-adsorbed catalyst composition to the surface of the substrate, wherein the self-adsorbed catalyst composition includes a colloidal nanoparticle and a silane compound, the colloidal nanoparticle includes a palladium nanoparticle and a capping agent enclosing the palladium nanoparticle, and the silane compound has at least one amino group, and the colloid nanoparticle has a particle size ranging from 5 to 10 nanometers; and
performing an electroless metal deposition for forming the metal layer on the surface of the substrate.

18. The method according to claim 17 , wherein the method further includes: pre-treating the substrate with sulfuric acid and immersing the substrate into a solution containing the self-adsorbed catalyst composition.

19. The method according to claim 17 , wherein the self-adsorbed catalyst composition is prepared by steps of:
providing a colloidal nanoparticle solution including the colloidal nanoparticle and a solvent;
mixing the colloidal nanoparticle solution with the silane compound for forming the self-adsorbed catalyst composition.

20. The method according to claim 19 , wherein the silane compound is presented in an amount of from 0.5 to 5 vol. % based on the total volume of the colloidal nanoparticle solution and the silane compound.

Assignees

• Univ Nat Tsing Hua

Inventors

• Wei Tzu-Chien
• Kao Yu-Hsiang

Classifications

• B01J35/45

  Nanoparticles · CPC title

• B01J2235/00

  Indexing scheme associated with group B01J35/00, related to the analysis techniques used to determine the catalysts form or properties · CPC title

• B01J2235/30

  Scanning electron microscopy; Transmission electron microscopy · CPC title

• B01J35/23

  in a colloidal state · CPC title

• B01J35/393

  Metal or metal oxide crystallite size · CPC title