Conductive laminate and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11745469-B2
Application number	US-202217719551-A
Country	US
Kind code	B2
Filing date	Apr 13, 2022
Priority date	Sep 28, 2018
Publication date	Sep 5, 2023
Grant date	Sep 5, 2023

Abstract

A method for manufacturing a conductive laminate and a conductive laminate are provided. The method for manufacturing the conductive laminate includes steps of: providing a substrate having a surface; immersing the substrate into a modifying solution including a silane with a hydrophilic group to form a discontinuous modified layer on the surface of the substrate; forming a barrier layer on the surface of the substrate and the discontinuous modified layer, and forming a conductive layer on a surface of the barrier layer. The barrier layer includes a polymer, and the polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

First claim

What is claimed is:

1. A method for manufacturing a conductive laminate, comprising:
providing a substrate having a surface;
immersing the substrate into a modifying solution including a silane with a hydrophilic group to form a discontinuous modified layer on the surface of the substrate;
forming a barrier layer on the surface of the substrate and the discontinuous modified layer, wherein the barrier layer including a polymer, and the polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof; and
forming a conductive layer on a surface of the barrier layer.

2. The method according to claim 1 , wherein the silane includes an amino group.

3. The method according to claim 2 , wherein an amount of the silane in the modification solution ranges from 0.1 volume percent to 5 volume percent.

4. The method according to claim 2 , wherein the silane is selected from the group consisting of (3-aminopropyl)triethoxysilane, N-(3-(trimethoxysilyl)propyl)ethylenediamine, 3-2-(2-aminoethylamino)ethylamino propyl trimethoxysilane, and any combination thereof.

5. The method according to claim 1 , wherein a polymer solution to form the barrier layer further includes a catalytic material that is encapsulated in the polymer.

6. The method according to claim 5 , wherein a weight ratio of the polymer to the catalytic material ranges from 0.175:1 to 2:1.

7. The method according to claim 5 , wherein the catalytic material includes a plurality of metallic nanoparticles.

8. The method according to claim 7 , wherein the plurality of metallic nanoparticles includes palladium nanoparticles.

9. The method according to claim 1 , wherein a modifying time required for the step of immersing the substrate into the modifying solution is less than 30 minutes.

10. The method according to claim 1 , wherein a modifying time required for the step of immersing the substrate into the modifying solution is equal to or less than 5 minutes.

11. The method according to claim 1 , wherein, before the step of immersing the substrate into a modifying solution, the method further comprises immersing the substrate into a pretreating solution selected from the group consisting of isopropanol, toluene, acetone, ethanol, and any combination thereof.

12. The method according to claim 11 , wherein the pretreating solution and the modifying solution includes a same component.

13. The method according to claim 12 , wherein the same component is isopropanol.

14. A conductive laminate, comprising:
a substrate having a surface;
a diffusion barrier structure disposed on the substrate, the diffusion barrier structure including a discontinuous modified layer and a barrier layer, wherein the discontinuous modified layer is disposed on the surface of the substrate and formed by immersing the substrate into a modifying solution including a silane with a hydrophilic group, and the barrier layer includes a polymer selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof; and
a conductive layer disposed on the diffusion barrier structure.

15. The conductive laminate according to claim 14 , wherein the silane includes an amino group.

16. The conductive laminate according to claim 15 , wherein the silane is selected from the group consisting of: (3-aminopropyl)triethoxysilane, N-(3-(trimethoxysilyl)propyl)ethylenediamine), 3-2-(2-aminoethylamino)ethylamino propyl trimethoxysilane, and any combination thereof.

17. The conductive laminate according to claim 14 , wherein the barrier layer includes metallic nanoparticles that are encapsulated in the polymer.

18. The conductive laminate according to claim 17 , wherein the metallic nanoparticles include palladium nanoparticles.

19. The conductive laminate according to claim 17 , wherein a weight ratio of the polymer to the metallic nanoparticles is from 0.175:1 to 2:1.

20. The conductive laminate according to claim 14 , wherein the discontinuous modified layer includes a plurality of island-shaped modified layers formed on the surface of the substrate.

Assignees

• Univ Nat Tsing Hua

Inventors

• Wei Tzu-Chien
• Wang Wei-Yen

Classifications

• H10W20/032

  of conductive barrier, adhesion or liner layers · CPC title

• H10W20/044

  for electroless plating · CPC title

• H10W20/074

  of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers · CPC title

• H10W20/425 Primary

  Barrier, adhesion or liner layers · CPC title

• B32B15/20 Primary

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title