Carrier-attached ultra-thin copper foil and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2025287508-A1
Application number	US-202418748121-A
Country	US
Kind code	A1
Filing date	Jun 20, 2024
Priority date	Mar 7, 2024
Publication date	Sep 11, 2025
Grant date	—

Abstract

A carrier-attached ultra-thin copper foil and a method for manufacturing the same are provided. The method includes modifying a polymer substrate with an amine-based polymer compound to form a modification layer on at least one surface of the polymer substrate. A palladium catalyst is then used to activate the modification layer, thereby forming an activation layer on the modification layer. Subsequently, an ultra-thin copper foil is formed on the activation layer, in which the polymer substrate can be separated from the ultra-thin copper foil via the modification layer and the activation layer.

First claim

What is claimed is:

1 . A method for manufacturing a carrier-attached ultra-thin copper foil, comprising:
a surface functionalization step that includes using an amine-based polymer compound to modify a polymer substrate, so as to form a modification layer on at least one surface of the polymer substrate; a surface activation step that includes using a palladium catalyst to activate the modification layer, so as to form an activation layer on a surface of the modification layer away from the polymer substrate; and a copper layer formation step that includes forming an ultra-thin copper foil on a surface of the activation layer away from the modification layer, thereby producing the carrier-attached ultra-thin copper foil; wherein the polymer substrate is capable of being separated from the ultra-thin copper foil through the modification layer and the activation layer.

2 . The method according to claim 1 , wherein the polymer substrate is a liquid crystal polymer substrate, and the amine-based polymer compound is polyethyleneimine (PEI).

3 . The method according to claim 2 , wherein the polyethyleneimine (PEI) is adsorbed onto the liquid crystal polymer substrate through electrostatic interaction, so as to form the modification layer.

4 . The method according to claim 2 , wherein the surface functionalization step includes modifying the surface of the liquid crystal polymer substrate with a first aqueous solution containing polyethyleneimine (PEI), so as to form the modification layer; wherein, in the first aqueous solution, a volume percentage concentration of polyethyleneimine ranges from 0.7 vol % to 1.3 vol %.

5 . The method according to claim 4 , wherein a nitrogen peak is detected from the modification layer by an X-ray photoelectron spectrometer (XPS), and an elemental ratio of nitrogen atoms ranges from 3 atomic % to 9 atomic %.

6 . The method according to claim 1 , wherein the palladium catalyst is at least one of a polyvinyl alcohol polymer-palladium (PVA-Pd) catalyst, a polyvinyl pyrrolidone capped palladium (PVP-Pd) catalyst, a tin-palladium colloidal catalyst, and an ionic palladium catalyst.

7 . The method according to claim 6 , wherein the surface activation step includes activating the modification layer with a second aqueous solution containing the palladium catalyst to form the activation layer; wherein, in the second aqueous solution, a concentration of the palladium catalyst ranges from 20 ppm to 120 ppm.

8 . The method according to claim 1 , wherein the copper layer formation step includes sequentially forming a first copper layer and a second copper layer on the surface of the activation layer away from the polymer substrate, and the first copper layer and the second copper layer together constitute the ultra-thin copper foil; wherein the first copper layer is an electroless copper layer having a thickness ranging from 200 nanometers to 800 nanometers, and the second copper layer is an electroplated copper layer having a thickness ranging from 1 micrometer to 10 micrometers.

9 . A carrier-attached ultra-thin copper foil comprising:
a polymer substrate; a modification layer formed on at least one surface of the polymer substrate, wherein the modification layer is formed of an amine-based polymer compound; an activation layer formed on a surface of the modification layer away from the polymer substrate, wherein the activation layer is formed of a palladium catalyst; and an ultra-thin copper foil formed on a surface of the activation layer away from the modification layer; wherein the polymer substrate is capable of being separated from the ultra-thin copper foil via the modification layer and the activation layer.

10 . The carrier-attached ultra-thin copper foil according to claim 9 , wherein the polymer substrate is a liquid crystal polymer substrate, and the amine-based polymer compound is polyethyleneimine (PEI); wherein a peeling strength of the polymer substrate separated from the ultra-thin copper foil through the modified layer and the activation layer is between 25 gf/cm and 40 gf/cm, measured according to JIS Z 0237-2009 standard.

Assignees

• Univ Nat Tsing Hua
• Chang Chun Plastics Co Ltd
• Chang Chun Petrochemical Co Ltd
• Dairen Chemical Corp

Inventors

• Wei Tzu-Chien
• Kattoor Vidya
• Tu An-Pang
• Wu Chia-Hung

Classifications

• H05K3/022

  Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• H05K3/025 Primary

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• C23C18/38

  Coating with copper · CPC title

• C23C18/1657

  Electroless forming, i.e. substrate removed or destroyed at the end of the process · CPC title