Substrate surface metallization method and substrate having metallized surface manufactured by the same

Patent metadata

Field	Value
Publication number	US-9875984-B2
Application number	US-201615343029-A
Country	US
Kind code	B2
Filing date	Nov 3, 2016
Priority date	Dec 5, 2014
Publication date	Jan 23, 2018
Grant date	Jan 23, 2018

Abstract

A substrate having a metallized surface is provided. The substrate includes a substrate having a silanated surface, an adhesive layer disposed on the silanated surface, and a first metallic layer bonded to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, and the colloidal nanoparticle group may include metallic nanoparticles capped with polymer. The first metallic layer and the adhesive layer have chemical bonds formed there between. The substrate may further include a second metallic layer which is electro-plated onto the first metallic layer. A method for metallizing a surface of a substrate is also provided.

First claim

What is claimed is:

1. A method for metallizing a surface of a substrate, comprising:
silanating the surface of the substrate;
forming an adhesive layer on the surface which is silanated, wherein the adhesive layer includes a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups include metallic nanoparticles capped with a polymer; and
bonding a first metallic layer to the silanated surface through the adhesive layer, wherein the first metallic layer and the adhesive layer have chemical bonds formed there between.

2. The method of claim 1 , wherein the step of silanating the surface of the substrate further comprises forming an OH group on the surface of the substrate.

3. The method of claim 2 , wherein the step of forming the OH group is accomplished by RCA clean method, Piranha clean method, UV-ozone clean method, or oxygen plasma method.

4. The method of claim 1 , further comprising electro-plating a second metallic layer onto the first metallic layer.

5. A method for metallizing a surface of a substrate, comprising:
forming OH groups on the surface of the substrate;
modifying the surface of the substrate by using silane compound having amino functional groups;
forming an adhesive layer on the surface, wherein the adhesive layer includes colloidal nanoparticle groups having metallic nanoparticles capped with polymer; and
forming a first metallic layer to the surface, wherein the first metallic layer and the adhesive layer have bonds formed between the amino functional groups and the colloidal nanoparticle groups.

6. The method of claim 5 , wherein the step of forming the OH groups on the surface of the substrate includes utilizing anhydrous ethanol so the surface of the substrate can be modified evenly.

7. The method of claim 5 , wherein the step of forming the OH groups on the surface of the substrate is performed by RCA clean method, Piranha clean method, UV-ozone clean method, or oxygen plasma method.

8. The method of claim 5 , wherein the silane compound includes ETAS (3-[2-(2-Aminoethylamine)ethyl-amino]propyltrimethoxysilane).

9. The method of claim 5 , wherein the silane compounds are provided in a solution including anhydrous ethanol and ETAS (3-[2-(2-Aminoethylamine)ethyl-amino]propyltrimethoxysilane).

10. The method of claim 5 , further comprising electro-plating a second metallic layer onto the first metallic layer.

11. The method of claim 5 , wherein the colloidal nanoparticle groups have diameters ranging from 5 nanometers to 10 nanometers.

12. The method of claim 5 , wherein the polymer has molecular weight ranging from 5,000 to 10,000.

13. The method of claim 5 , wherein the substrate is a silicon substrate, an Al 2 O 3 (Aluminium oxide) substrate, or an AlN (Aluminium Nitride) substrate.

14. A method for metallizing a surface of a substrate, comprising:
forming OH groups on the surface of the substrate;
modifying the surface of the substrate by using solution including silane compound and anhydrous ethanol;
forming an adhesive layer on the surface, wherein the adhesive layer includes colloidal nanoparticle groups having metallic nanoparticles capped with polymer; and
bonding a first metallic layer to the surface through the adhesive layer, wherein the first metallic layer and the adhesive layer have chemical bonds formed there between.

15. The method of claim 14 , wherein the step of forming the OH groups includes immersing the substrate in anhydrous ethanol so the surface of the substrate can be modified evenly.

16. The method of claim 14 , wherein the step of forming the OH groups includes RCA clean method, Piranha clean method, UV-ozone clean method, or oxygen plasma method.

17. The method of claim 14 , wherein the silane compound includes amino silane compound.

18. The method of claim 17 , further comprising performing ultrasonic vibration to the substrate to remove the aminosilane compound that is physically attached to the substrate.

19. The method of claim 14 , wherein the silane compound includes ETAS (3-[2-(2-Aminoethylamine)ethyl-amino]propyltrimethoxysilane).

20. The method of claim 14 , wherein the substrate is an AlN (Aluminium Nitride) substrate, and the step of forming the OH groups is performed by RCA clean method.

Assignees

• Univ Nat Tsing Hua

Inventors

• Wei Tzu-Chien
• Chen Chih-Ming
• Pan Tseng-Chieh
• Lai Kuei-Chang
• Wu Chung-Han
• Chen Kuei-Po
• Ou Nai-Tien
• Hong cheng-you

Classifications

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10P14/418

  the conductive layers comprising transition metals · CPC title

• H10P14/46

  using a liquid · CPC title