Substrate surface metallization method and substrate having metallized surface manufactured by the same

Patent metadata

Field	Value
Publication number	US-9514965-B2
Application number	US-201514957787-A
Country	US
Kind code	B2
Filing date	Dec 3, 2015
Priority date	Dec 5, 2014
Publication date	Dec 6, 2016
Grant date	Dec 6, 2016

Abstract

A substrate having metallized surface is provided. The substrate having metallized surface includes a silicon substrate, an adhesive layer and a metallic layer. The silicon substrate has a silanated surface and the adhesive layer is disposed on the silanated surface. The metallic layer bonds to the silanated surface through the adhesive layer. The adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer, and the metallic layer and the adhesive layer have chemical bonds formed there between.

First claim

What is claimed is:

1. A substrate having metallized surface, comprising:
a silicon substrate having a silanated surface;
an adhesive layer disposed on the silanated surface, wherein the adhesive layer is formed with a plurality of colloidal nanoparticle groups, the colloidal nanoparticle groups each include at least one metallic nanoparticle capped with at least one polymer; and
an electroless metallic layer bonded to the silanated surface through the adhesive layer;
wherein the electroless metallic layer and the adhesive layer have chemical bonds formed there between.

2. The substrate having metallized surface of claim 1 , wherein the electroless metallic layer is a nickel layer or a nickel alloy layer.

3. The substrate having metallized surface of claim 1 , wherein the silanated surface has a silane layer having at least one amino functional group.

4. The substrate having metallized surface of claim 3 , wherein the amino functional group has one to three amino-groups.

5. The substrate having metallized surface of claim 1 , wherein the polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinyl alcohol, polyacrylic acid, and any combination thereof.

6. The substrate having metallized surface of claim 1 , wherein the structural formula of the polymer is

7. The substrate having metallized surface of claim 6 , wherein the metallic nanoparticle is capped with an oxygen atom of the polymer.

8. The substrate having metallized surface of claim 6 , wherein the polymer has molecular weight ranging from 5000 to 10000.

9. The substrate having metallized surface of claim 6 , wherein the colloidal nanoparticle groups each have a diameter ranging from 5 nanometers to 10 nanometers.

Assignees

• Nat Univ Tsing Hua

Inventors

• Wei Tzu-Chien
• Chen Chih-Ming
• Pan Tseng-Chieh
• Lai Kuei-Chang
• Wu Chung-Han
• Chen Kuei-Po
• Ou Nai-Tien
• Huang Kuei-Wu

Classifications

• H10P70/27 Primary

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10P14/418

  the conductive layers comprising transition metals · CPC title

• H10P14/46

  using a liquid · CPC title

• H10W70/095

  of vias therein · CPC title