Diffusion barrier structure, and conductive laminate and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11331883-B2
Application number	US-201916510208-A
Country	US
Kind code	B2
Filing date	Jul 12, 2019
Priority date	Sep 28, 2018
Publication date	May 17, 2022
Grant date	May 17, 2022

Abstract

A diffusion barrier structure, and a conductive laminate and a manufacturing method thereof are provided. The conductive laminate includes a substrate, a diffusion barrier structure, and a conductive layer. The diffusion barrier structure is formed between the substrate and the conductive layer. The diffusion barrier structure includes a discontinuous modifying layer and a barrier layer. The discontinuous modifying layer is disposed on the substrate. A material for composing the discontinuous modifying layer is a polymer with hydrophilic group. The barrier layer is disposed on the substrate and the discontinuous modifying layer. A material for composing the barrier layer includes at least one self-healing polymer.

First claim

What is claimed is:

1. A diffusion barrier structure formed between a substrate and a conductive layer, comprising:
a discontinuous modifying layer disposed on the substrate, and a material for composing the discontinuous modifying layer including a silane with a hydrophilic group; and
a barrier layer disposed on the substrate and the discontinuous modifying layer, and a material for composing the barrier layer including at least one self-healing polymer; wherein the self-healing polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

2. The diffusion barrier structure according to claim 1 , wherein the silane with the hydrophilic group is a silane with an amino group.

3. The diffusion barrier structure according to claim 2 , wherein the silane with the amino group is selected from the group consisting of: (3-aminopropyl)triethoxysilane, N-(3-(trimethoxysilyl)propyl)ethylenediamine), 3-2-(2-aminoethylamino)ethylamino propyl trimethoxysilane, and any combination thereof.

4. The diffusion barrier structure according to claim 1 , wherein the barrier layer further includes a catalytic material.

5. The diffusion barrier structure according to claim 4 , wherein the catalytic material is metallic nanoparticles.

6. The diffusion barrier structure according to claim 4 , wherein a weight ratio of the self-healing polymer to the catalytic material in the barrier layer is from 0.175:1 to 2:1.

7. The diffusion barrier structure according to claim 4 , wherein the catalytic material is encapsulated in the self-healing polymer.

8. The diffusion barrier structure according to claim 1 , wherein a total thickness of the diffusion barrier structure is less than 5 nm.

9. A conductive laminate, comprising:
a substrate having a surface;
a diffusion barrier structure formed on the substrate, the diffusion barrier structure including a discontinuous modifying layer and a barrier layer, the discontinuous modifying layer disposed on the surface of the substrate, a material composing the discontinuous modifying layer including a silane with a hydrophilic group, the barrier layer disposed on the surface of the substrate and the discontinuous modifying layer, and a material composing the barrier layer including at least one self-healing polymer; wherein the self-healing polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof; and
a conductive layer disposed on the substrate, wherein the conductive layer is separated from the substrate by the diffusion barrier structure.

10. The conductive laminate according to claim 9 , wherein the material of the barrier layer further includes a catalytic material and an adhesive force between the conductive layer and the diffusion barrier structure is from 6 MPa to 15 MPa.

11. A method for manufacturing a conductive laminate, comprising:
providing a substrate having a surface;
performing a surface modification on the surface of the substrate to form a discontinuous modifying layer on the surface of the substrate;
forming a barrier layer on the surface and the discontinuous modifying layer; and
forming a conductive layer on a surface of the diffusion barrier structure;
wherein a material for composing the discontinuous modifying layer includes a silane with a hydrophilic group, and a material for composing the barrier layer includes a self-healing polymer; wherein the self-healing polymer is selected from the group consisting of: polyvinyl alcohol, polyvinylpyrrolidone, polyacrylic acid, polyethylene glycol, and any combination thereof.

12. The method according to claim 11 , wherein the silane with a hydrophilic group is a silane with an amino group.

13. The method according to claim 12 , wherein the silane with the amino group is selected from the group consisting of: (3-aminopropyl)triethoxysilane, N-(3-(trimethoxysilyl)propyl)ethylenediamine), 3-2-(2-aminoethylamino)ethylamino propyl trimethoxysilane, and any combination thereof.

14. The method according to claim 11 , wherein the barrier layer further includes a catalytic material.

15. The method according to claim 14 , wherein the catalytic material is metallic nanoparticles.

16. The method for manufacturing a conductive laminate according to claim 14 , wherein a weight ratio of the self-healing polymer to the catalytic material in the barrier layer is from 0.175:1 to 2:1.

17. The method for manufacturing a conductive laminate according to claim 14 , wherein the catalytic material is encapsulated in the self-healing polymer.

18. The method for manufacturing a conductive laminate according to claim 11 , wherein a total thickness of the discontinuous modifying layer and the barrier layer is less than 5 nm.

Assignees

• Univ Nat Tsing Hua

Inventors

• Wei Tzu-Chien
• Wang Wei-Yen

Classifications

• H10W20/032

  of conductive barrier, adhesion or liner layers · CPC title

• H10W20/044

  for electroless plating · CPC title

• H10W20/074

  of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers · CPC title

• H10W20/425 Primary

  Barrier, adhesion or liner layers · CPC title

• B32B2264/105

  Metal · CPC title