Efficient fabrication of memory structures
US-2025048652-A1 · Feb 6, 2025 · US
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Wei Lei patents
Wei Lei is listed as an inventor on 33 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wei Lei |
| Total patents | 33 |
| First publication | Feb 12, 2015 |
| Latest publication | Feb 6, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Cancer intervention by targeting genotypic differences using crispr-cas3 mediated deletion-editing
US-2025041447-A1 · Feb 6, 2025 · US
Multitier arrangements of integrated devices, and methods of forming sense/access lines
US-12144188-B2 · Nov 12, 2024 · US
Efficient fabrication of memory structures
US-12082425-B2 · Sep 3, 2024 · US
Reduced resistivity for access lines in a memory array
US-2024162156-A1 · May 16, 2024 · US
Reduced resistivity for access lines in a memory array
US-11830816-B2 · Nov 28, 2023 · US
Memory Circuitry Comprising Strings Of Memory Cells
US-2023317800-A1 · Oct 5, 2023 · US
Memory with optimized resistive layers
US-11778837-B2 · Oct 3, 2023 · US
Efficient fabrication of memory structures
US-2023225137-A1 · Jul 13, 2023 · US
Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines
US-2023165017-A1 · May 25, 2023 · US
Recent patents
Latest publications not already listed above.
Efficient fabrication of memory structures
US-11626452-B2 · Apr 11, 2023 · US
Three-dimensional memory arrays, and methods of forming the same
US-11616098-B2 · Mar 28, 2023 · US
Multitier arrangements of integrated devices, and methods of forming sense/access lines
US-11600666-B2 · Mar 7, 2023 · US
Pre-signed transaction requests for cryptographic key management
US-2023010791-A1 · Jan 12, 2023 · US
Memory with optimized resistive layers
US-2022406847-A1 · Dec 22, 2022 · US
Generating and initiating pre-signed transaction requests for flexibly and efficiently implementing secure cryptographic key management
US-11483132-B2 · Oct 25, 2022 · US
Three-dimensional memory arrays, and methods of forming the same
US-2022302212-A1 · Sep 22, 2022 · US
Memory with optimized resistive layers
US-11380732-B2 · Jul 5, 2022 · US
Generating and initiating pre-signed transaction requests for flexibly and efficiently implementing secure cryptographic key management
US-2022182222-A1 · Jun 9, 2022 · US
Sense lines in three-dimensional memory arrays, and methods of forming the same
US-11355554-B2 · Jun 7, 2022 · US
Reduced resistivity for access lines in a memory array
US-2022051984-A1 · Feb 17, 2022 · US
Memory with optimized resistive layers
US-2022037403-A1 · Feb 3, 2022 · US
Efficient fabrication of memory structures
US-2022037402-A1 · Feb 3, 2022 · US
Three-dimensional memory arrays, and methods of forming the same
US-2021351234-A1 · Nov 11, 2021 · US
Materials and methods for suppressing and/or treating cancer and/or cancer treatment induced cardiac toxicity
US-2021338699-A1 · Nov 4, 2021 · US
Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines
US-2021167132-A1 · Jun 3, 2021 · US
Multitier arrangements of integrated devices, and methods of forming sense/access lines
US-10957741-B2 · Mar 23, 2021 · US
Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines
US-2020350370-A1 · Nov 5, 2020 · US
Diversification of public keys
US-10776502-B2 · Sep 15, 2020 · US
Dynamic in-fiber particle production with precise dimensional control
US-10406723-B2 · Sep 10, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 23 |
| Apple Inc | 3 |
| Meta Platforms Inc | 3 |
| Massachusetts Inst Technology | 2 |
| Univ Central Florida Res Found | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10N70/231 | 19 |
| H10N70/826 | 15 |
| H10B63/84 | 15 |
| H10N70/011 | 14 |
| H10N70/063 | 13 |