Matching pre-processing and post-processing substrate samples
US-12581917-B2 · Mar 17, 2026 · US
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Tan Zhongkui patents
Tan Zhongkui is listed as an inventor on 59 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Tan Zhongkui |
| Total patents | 59 |
| First publication | Jul 7, 2016 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
In situ declogging in plasma etching
US-2026026274-A1 · Jan 22, 2026 · US
High aspect ratio carbon etch with simulated bosch process
US-2026010143-A1 · Jan 8, 2026 · US
Systems and methods for reverse pulsing
US-2026011531-A1 · Jan 8, 2026 · US
Integrated high aspect ratio etching
US-2025391658-A1 · Dec 25, 2025 · US
Systems and methods for reverse pulsing
US-12437966-B2 · Oct 7, 2025 · US
In situ declogging in plasma etching
US-2025226233-A1 · Jul 10, 2025 · US
Method for etching features using a targeted deposition for selective passivation
US-2025149330-A1 · May 8, 2025 · US
Method for etching features using a targeted deposition for selective passivation
US-12217955-B2 · Feb 4, 2025 · US
Methods and systems for advanced ion control for etching processes
US-12165872-B2 · Dec 10, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor mask reshaping using a sacrificial layer
US-12165878-B2 · Dec 10, 2024 · US
Method and apparatus for etching a carbon containing layer
US-2024379375-A1 · Nov 14, 2024 · US
Matching pre-processing and post-processing substrate samples
US-2024112961-A1 · Apr 4, 2024 · US
Systems and methods for reverse pulsing
US-2024030000-A1 · Jan 25, 2024 · US
Systems for reverse pulsing
US-11798785-B2 · Oct 24, 2023 · US
Directional deposition in etch chamber
US-11742212-B2 · Aug 29, 2023 · US
Silicon oxide silicon nitride stack stair step etch
US-11646207-B2 · May 9, 2023 · US
Method for etching features using a targeted deposition for selective passivation
US-2022301853-A1 · Sep 22, 2022 · US
Semiconductor mask reshaping using a sacrificial layer
US-2022076962-A1 · Mar 10, 2022 · US
Directional deposition in etch chamber
US-2022028697-A1 · Jan 27, 2022 · US
Silicon oxide silicon nitride stack stair step etch
US-2021407811-A1 · Dec 30, 2021 · US
Methods and systems for advanced ion control for etching processes
US-11049726-B2 · Jun 29, 2021 · US
Methods and Systems for Advanced Ion Control for Etching Processes
US-2021193474-A1 · Jun 24, 2021 · US
Amorphous carbon layer opening process
US-11037784-B2 · Jun 15, 2021 · US
Methods and systems for advanced ion control for etching processes
US-10943789-B2 · Mar 9, 2021 · US
Amorphous carbon layer opening process
US-2021035796-A1 · Feb 4, 2021 · US
Silicon-based deposition for semiconductor processing
US-10658194-B2 · May 19, 2020 · US
Edge ring focused deposition during a cleaning process of a processing chamber
US-2019341275-A1 · Nov 7, 2019 · US
Method and apparatus for anisotropic tungsten etching
US-10354888-B2 · Jul 16, 2019 · US
Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber
US-10242845-B2 · Mar 26, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 59 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/242 | 44 |
| H01J2237/334 | 36 |
| H01L21/3065 | 34 |
| H10P72/0421 | 33 |
| H10P50/73 | 30 |