Methods and systems for advanced ion control for etching processes

Patent metadata

Field	Value
Publication number	US-10943789-B2
Application number	US-201715819696-A
Country	US
Kind code	B2
Filing date	Nov 21, 2017
Priority date	Nov 4, 2015
Publication date	Mar 9, 2021
Grant date	Mar 9, 2021

Abstract

A substrate is disposed on a substrate holder within a process module. The substrate includes a mask material overlying a target material with at least one portion of the target material exposed through an opening in the mask material. A plasma is generated in exposure to the substrate. For a first duration, a bias voltage is applied at the substrate holder at a first bias voltage setting corresponding to a high bias voltage level. For a second duration, after completion of the first duration, a bias voltage is applied at the substrate holder at a second bias voltage setting corresponding to a low bias voltage level. The second bias voltage setting is greater than 0 V. The first and second durations are repeated in an alternating and successive manner for an overall period of time necessary to remove a required amount of the target material exposed on the substrate.

First claim

What is claimed is:

1. A system for controlling ions during a plasma processing operation performed on a substrate, comprising:
radiofrequency (RF) synchronization logic configured to control a first bias RF generator, a second bias RF generator, and a coil RF power supply to operate in accordance with a first process state and a second process state such that the first and second process states alternate in a successive manner for an overall period of time, such that the first process state transitions directly into the second process state, and such that the second process state transitions directly into the first process state, the coil RF power supply connected to supply power to a coil to generate a plasma,
the first process state having the first and second bias RF generators operate to apply a high bias voltage level and the coil RF power supply operate to supply a low power,
the second process state having the first and second bias RF generators operate to apply a low bias voltage level and the coil RF power supply operate to supply a high power, the low bias voltage level being greater than zero volt.

2. The system as recited in claim 1 , wherein the low bias voltage level is less than a threshold bias voltage required for ion-induced removal of a mask material from a substrate.

3. The system as recited in claim 1 , wherein the first and second bias RF generators apply bias voltage at a substrate holder.

4. The system as recited in claim 3 , wherein the plasma is generated over the substrate holder.

5. The system as recited in claim 1 , wherein the high bias voltage level is within a range extending from about 400 V to about 3000 V, and
wherein the low bias voltage level is within a range extending from about 20 V to about 300 V.

6. The system as recited in claim 1 , wherein the RF synchronization logic is configured to control a duration of the first process state to be at least 1 second and a duration of the second process state to be at least 1 second.

7. The system as recited in claim 1 , wherein the RF synchronization logic is configured to control a duration of the first process state to be less than 100 milliseconds and a duration of the second process state to be less than 100 milliseconds.

8. The system as recited in claim 7 , wherein the duration of the first process state and the duration of the second process state together define a bias voltage cycle, and wherein the RF synchronization logic is configured to control a frequency of repetition of the bias voltage cycle to be of a same order of magnitude as a frequency of RF signals transmitted by either the first bias RF generator or the second bias RF generator.

9. The system as recited in claim 1 , wherein the RF synchronization logic is configured to control a duration of the first process state to be different than a duration of the second process state.

10. The system as recited in claim 1 , wherein the RF synchronization logic is configured to control a duration of the first process state to be substantially equal to a duration of the second process state.

11. The system as recited in claim 1 , wherein the RF synchronization logic is configured to control a duration of the first process state to be less than ten percent of a sum of the durations of the first and second process states.

12. The system as recited in claim 1 , wherein the RF synchronization logic is configured to operate both the first and second bias RF generators in the first process state, and wherein the RF synchronization logic is configured to operate the second bias RF generator but not the first bias RF generator in the second process state, the second bias RF generator configured to generate continuous wave RF signals.

13. The system as recited in claim 1 , wherein the substrate includes a mask material overlying a target material, wherein the RF synchronization logic is configured to control the first and second bias RF generators during the second process state to apply a sufficiently low bias voltage level to avoid ion-induced removal of the mask material from the substrate.

14. The system as recited in claim 1 , wherein the RF synchronization logic is configured to control the coil RF power supply to supply the low power within a range extending from about 50 Watts (W) to about 2000 W during the first process state, and
wherein the RF synchronization logic is configured to control the coil RF power supply to supply the high power within a range extending from about 2000 W to about 5000 W during the second process state.

15. The system as recited in claim 1 , wherein the RF synchronization logic is configured to control one or both of the first and second bias RF generators to transmit RF signals of a first frequency during the first process state, and
wherein the RF synchronization logic is configured to control one or both of the first and second bias RF generators to transmit RF signals of a second frequency during the second process state, the second frequency lower than the first frequency.

16. The system as recited in claim 15 , wherein the first frequency is within a range extending from about 13 megaHertz (MHz) to about 60 MHz, and wherein the second frequency is within a range extending from about 400 kiloHertz (kHz) to about 2 MHz.

Assignees

• Lam Res Corp

Inventors

• Tan Zhongkui
• Fu Qian
• Wu Ying
• Xu Qing
• Drewery John

Classifications

• H10P72/0421

  for drying etching · CPC title

• H10P50/691

  for Group V materials or Group III-V materials · CPC title

• H10P50/287

  by chemical means · CPC title

• H10P50/285

  of materials not containing Si, e.g. PZT or Al2O3 · CPC title

• H10P50/283

  by chemical means · CPC title