Highly Textured Buffer Layer to Grow YBiPt (110) For Spintronic Applications
US-2026073938-A1 · Mar 12, 2026 · US
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Takano Hisashi patents
Takano Hisashi is listed as an inventor on 56 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Takano Hisashi |
| Total patents | 56 |
| First publication | Nov 30, 2023 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Nitrogenating of Topological Semi-Metal Films to Increase Resistivity
US-2026066168-A1 · Mar 5, 2026 · US
Crystallized YPtBi (111) Topological Semi-Metal (TSM) Induced by (111) or (002)-(111) Buffers
US-2026066171-A1 · Mar 5, 2026 · US
High Oxidation Resistive Cap Layers For Topological Semi-metal and Insulator Materials
US-2026066170-A1 · Mar 5, 2026 · US
High Resistivity Buffers and Interlayers to Promote BiSb (012) and (001) and Minimized Shunting
US-2026066169-A1 · Mar 5, 2026 · US
Magnetic heads having low magnetic coercivity (Hc) and high saturated magnetic flux density (Bs) in ferromagnetic (FM) layer(s) or shield(s) with minimized saturation
US-12567438-B2 · Mar 3, 2026 · US
Nitrogen Doped Oxides For Lower Bandgap
US-2026058046-A1 · Feb 26, 2026 · US
Spin orbit torque based thermal sensor for insitu monitoring of magnetic recording head
US-2026050050-A1 · Feb 19, 2026 · US
Highly textured buffer layer to grow YBiPt (110) for spintronic applications
US-12505856-B2 · Dec 23, 2025 · US
Spin orbit torque based thermal sensor for insitu monitoring of magnetic recording head
US-12487296-B2 · Dec 2, 2025 · US
Recent patents
Latest publications not already listed above.
Buffer Layers And Interlayers That Promote BiSbx (012) Alloy Orientation For SOT And MRAM Devices
US-2025366376-A1 · Nov 27, 2025 · US
Nitrogen doped oxides for lower bandgap
US-12482588-B2 · Nov 25, 2025 · US
Sensor based on Direct Spin Hall Effect
US-2025359486-A1 · Nov 20, 2025 · US
In-Memory AI Inference with Multi-state Weight based on Vertical Domain Control
US-2025322228-A1 · Oct 16, 2025 · US
In-Memory AI Inference with Multi-state Weight based on Vertical Domain Control
US-2025322870-A1 · Oct 16, 2025 · US
Non-localized spin valve multi-free-layer reader hybridized with spin orbit torque layers
US-12412597-B2 · Sep 9, 2025 · US
Magnetic sensor half-bridge based on inverse spin hall effect with reduced thermal drift
US-12405323-B2 · Sep 2, 2025 · US
Buffer layers and interlayers that promote BiSbx (012) alloy orientation for sot and MRAM devices
US-12408560-B2 · Sep 2, 2025 · US
Head and media overcoats for heat assisted magnetic recording
US-12400680-B1 · Aug 26, 2025 · US
YPtBi 1:1:1 Composition Design Using Krypton Sputtering in Deposition Systems
US-2025266198-A1 · Aug 21, 2025 · US
Non-localized spin valve reader hybridized with spin orbit torque layer
US-12394432-B2 · Aug 19, 2025 · US
Buffer Layers to Grow BiSb and YPtBi to Match the Crystal Symmetry of Interlayers and Ferromagnetic layers to Generate Spin-Polarized Current
US-2025255195-A1 · Aug 7, 2025 · US
Shunt Reducing Migration Barrier Layer Materials and Insertion Techniques for Epitaxial Topological Materials
US-2025252971-A1 · Aug 7, 2025 · US
RuAl and MgTiO Lamination For Effective Buffer and Interlayers For Topological Material Layers
US-2025246353-A1 · Jul 31, 2025 · US
Dopants to Increase BiSbX Bandgap for Optimal CPP Conductivity
US-2025248317-A1 · Jul 31, 2025 · US
Nitrogen Doped Oxides for Lower Bandgap
US-2025226140-A1 · Jul 10, 2025 · US
Dopants to Decrease BiSbX's and YBiPt's Bandgap for Optimal Current-In-Plane (CIP) Conductivity
US-2025228140-A1 · Jul 10, 2025 · US
SOT reader with recessed SOT topological insulator material
US-12354629-B2 · Jul 8, 2025 · US
Higher areal density non-local spin orbit torque (SOT) writer with topological insulator materials
US-12354627-B2 · Jul 8, 2025 · US
Magnetic Heads Having Low Magnetic Coercivity (HC) And High Saturated Magnetic Flux Density (BS) In Ferromagnetic (FM) Layer(s) Or Shield(s) With Minimized Saturation
US-2025218457-A1 · Jul 3, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Western Digital Tech Inc | 56 |
| Tokyo Inst Tech | 12 |
| Inst Of Science Tokyo | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G11B5/3909 | 32 |
| H10N50/10 | 24 |
| H10N50/85 | 21 |
| G11B5/3912 | 20 |
| G11B2005/0024 | 16 |