Integrated circuits and manufacturing methods thereof
US-12094880-B2 · Sep 17, 2024 · US
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Sung Shu-Hui patents
Sung Shu-Hui is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sung Shu-Hui |
| Total patents | 16 |
| First publication | Jun 25, 2015 |
| Latest publication | Sep 17, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuits and manufacturing methods thereof
US-2023197723-A1 · Jun 22, 2023 · US
Integrated circuits and manufacturing methods thereof
US-11581314-B2 · Feb 14, 2023 · US
Integrated circuits and manufacturing methods thereof
US-2020126986-A1 · Apr 23, 2020 · US
Integrated circuits and manufacturing methods thereof
US-10535655-B2 · Jan 14, 2020 · US
Semiconductor device including source/drain contact having height below gate stack
US-9917050-B2 · Mar 13, 2018 · US
Designed-based interconnect structure in semiconductor structure
US-9754881-B2 · Sep 5, 2017 · US
Thermal analysis for tiered semiconductor structure
US-9659115-B2 · May 23, 2017 · US
Structure And Method For Semiconductor Device
US-2017040259-A1 · Feb 9, 2017 · US
Integrated circuits and manufacturing methods thereof
US-2016372469-A1 · Dec 22, 2016 · US
Recent patents
Latest publications not already listed above.
Method of forming semiconductor device including source/drain contact having height below gate stack
US-9478636-B2 · Oct 25, 2016 · US
Designed-based interconnect structure in semiconductor structure
US-2016172297-A1 · Jun 16, 2016 · US
Designed-based interconnect structure in semiconductor structure
US-9281273-B1 · Mar 8, 2016 · US
Designed-based interconnect structure in semiconductor structure
US-2016064322-A1 · Mar 3, 2016 · US
Structure and Method for Semiconductor Device
US-2015332962-A1 · Nov 19, 2015 · US
Thermal analysis for tiered semiconductor structure
US-2015179529-A1 · Jun 25, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 15 |
| Taiwan Semiconductor Mfg | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D89/10 | 10 |
| H10D84/038 | 10 |
| H01L2924/0002 | 8 |
| H10W20/42 | 8 |
| H01L27/0207 | 7 |