Non-volatile memory device, method of manufacturing the same, and memory system including the same
US-2026089952-A1 · Mar 26, 2026 · US
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Sim Jaeryong patents
Sim Jaeryong is listed as an inventor on 31 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Sim Jaeryong |
| Total patents | 31 |
| First publication | Nov 5, 2020 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device including vertical memory structure and separation structure each including side surface slope changing portion and data storage system including the same
US-12490428-B2 · Dec 2, 2025 · US
Semiconductor device and data storage system including the same
US-2025359047-A1 · Nov 20, 2025 · US
Semiconductor memory device
US-2025351351-A1 · Nov 13, 2025 · US
Semiconductor device and electronic system
US-12408346-B2 · Sep 2, 2025 · US
Semiconductor device and data storage system including the same
US-12402307-B2 · Aug 26, 2025 · US
Three-dimensional semiconductor memory device and electronic system including the same
US-12363904-B2 · Jul 15, 2025 · US
Semiconductor device and data storage system including the same
US-2025056808-A1 · Feb 13, 2025 · US
Semiconductor device having dummy structures in a peripheral region and data storage system including the same
US-12185548-B2 · Dec 31, 2024 · US
Semiconductor device and electronic system
US-2024357825-A1 · Oct 24, 2024 · US
Recent patents
Latest publications not already listed above.
Integrated circuit device
US-12114504-B2 · Oct 8, 2024 · US
Semiconductor device and electronic system
US-12058866-B2 · Aug 6, 2024 · US
Semiconductor device and method of manufacturing the same
US-11844214-B2 · Dec 12, 2023 · US
Three-dimensional semiconductor memory device, electronic system including the same, and method of fabricating the same
US-2023247835-A1 · Aug 3, 2023 · US
Three-dimensional semiconductor memory devices having a source structure that overlaps a buried insulating layer
US-11616078-B2 · Mar 28, 2023 · US
Semiconductor device and data storage system including the same
US-2022406801-A1 · Dec 22, 2022 · US
Semiconductor devices
US-11515322-B2 · Nov 29, 2022 · US
Three-dimensional semiconductor memory device and electronic system including the same
US-2022328511-A1 · Oct 13, 2022 · US
Semiconductor device and data storage system including the same
US-2022310639-A1 · Sep 29, 2022 · US
Semiconductor devices including dummy patterns for discharging effects
US-11411078-B2 · Aug 9, 2022 · US
Three-dimensional semiconductor memory device
US-11404434-B2 · Aug 2, 2022 · US
Semiconductor device and method of manufacturing the same
US-2022149060-A1 · May 12, 2022 · US
Semiconductor device and data storage system including the same
US-2022102369-A1 · Mar 31, 2022 · US
Integrated circuit device
US-2022052069-A1 · Feb 17, 2022 · US
Semiconductor device and electronic system
US-2022045083-A1 · Feb 10, 2022 · US
Three-dimensional semiconductor memory devices
US-2021384220-A1 · Dec 9, 2021 · US
Three-dimensional semiconductor memory devices having source structure overlaps buried insulating layer
US-11114461-B2 · Sep 7, 2021 · US
Semiconductor devices
US-2021098483-A1 · Apr 1, 2021 · US
Three-dimensional semiconductor memory device
US-2021036010-A1 · Feb 4, 2021 · US
Semiconductor devices including dummy patterns
US-2021013304-A1 · Jan 14, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 31 |
Top CPC classifications
Most common classification codes across this inventor's patents.